- Untangle the initialization and updates of passive and active trip
points in the ACPI thermal driver (Rafael Wysocki).
- Reduce code duplication related to the initialization and updates
of trip points in the ACPI thermal driver (Rafael Wysocki).
- Use trip pointers for cooling device binding in the ACPI thermal
driver (Rafael Wysocki).
- Simplify critical and hot trips representation in the ACPI thermal
driver (Rafael Wysocki).
- Use trip pointers in thermal governors and in the related part of
the thermal core (Rafael Wysocki).
- Drop the trips_disabled bitmask that has become redundant from the
thermal core (Rafael Wysocki).
- Avoid updating trip points when the thermal zone temperature falls
into a trip point's hysteresis range (ícolas F. R. A. Prado).
- Add power floor notifications support to the int340x thermal control
driver (Srinivas Pandruvada).
- Rework updating trip points in the int340x thermal driver so that it
does not access thermal zone internals directly (Rafael Wysocki).
- Use param_get_byte() instead of param_get_int() as the max_idle module
parameter .get() callback in the Intel powerclamp thermal driver to
avoid possible out-of-bounds access (David Arcari).
- Add workload hints support to the int340x thermal driver (Srinivas
Pandruvada).
- Add support for Mediatek LVTS MT8192 along with suspend/resume
routines (Balsam Chihi).
- Fix probe for THERMAL_V2 in the Mediatek LVTS driver (Markus
Schneider-Pargmann).
- Remove duplicate error message from the max76620 driver when
thermal_of_zone_register() fails (Thierry Reding).
- Add i.MX7D compatible bindings to fix a warning from dtbs_check for
the imx6ul platform (Alexander Stein).
- Add sa8775p compatible to the QCom tsens driver (Priyansh Jain).
- Fix error check in lvts_debugfs_init() to be against PTR_ERR() in the
LVTS Mediatek driver (Minjie Du).
- Remove unused variable in thermal/tools (Kuan-Wei Chiu).
- Document the imx8dl thermal sensor (Fabio Estevam).
- Add variable names in callback prototypes to prevent warning from
checkpatch.pl in the imx8mm driver (Bragatheswaran Manickavel).
- Add missing unevaluatedProperties on child node schemas for tegra124
(Rob Herring)
- Add mt7988 support to the Mediatek LVTS driver (Frank Wunderlich).
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Merge tag 'thermal-6.7-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm
Pull thermal control updates from Rafael Wysocki:
"These further rework the ACPI thermal driver, after the changes made
to it in the previous cycle, to make it easier to grasp, get rid of
redundant pieces of internal data structures and eliminate its
reliance on a specific ordering of trip point objects in the thermal
core, make thermal core adjustments needed for the ACPI thermal driver
rework, modify the thermal governor interface so as to use trip
pointers for representing trip points in it, switch over multiple
thermal drivers to using void platform driver remove callbacks, add
support for 2 hardware features to the Intel int340x thermal driver,
add support for new hardware on ARM platforms, update documentation,
fix problems, clean up code and update the MAINTAINERS record for
thermal control.
Specifics:
- Untangle the initialization and updates of passive and active trip
points in the ACPI thermal driver (Rafael Wysocki)
- Reduce code duplication related to the initialization and updates
of trip points in the ACPI thermal driver (Rafael Wysocki)
- Use trip pointers for cooling device binding in the ACPI thermal
driver (Rafael Wysocki)
- Simplify critical and hot trips representation in the ACPI thermal
driver (Rafael Wysocki)
- Use trip pointers in thermal governors and in the related part of
the thermal core (Rafael Wysocki)
- Drop the trips_disabled bitmask that has become redundant from the
thermal core (Rafael Wysocki)
- Avoid updating trip points when the thermal zone temperature falls
into a trip point's hysteresis range (ícolas F. R. A. Prado)
- Add power floor notifications support to the int340x thermal
control driver (Srinivas Pandruvada)
- Rework updating trip points in the int340x thermal driver so that
it does not access thermal zone internals directly (Rafael
Wysocki)
- Use param_get_byte() instead of param_get_int() as the max_idle
module parameter .get() callback in the Intel powerclamp thermal
driver to avoid possible out-of-bounds access (David Arcari)
- Add workload hints support to the int340x thermal driver (Srinivas
Pandruvada)
- Add support for Mediatek LVTS MT8192 along with suspend/resume
routines (Balsam Chihi)
- Fix probe for THERMAL_V2 in the Mediatek LVTS driver (Markus
Schneider-Pargmann)
- Remove duplicate error message from the max76620 driver when
thermal_of_zone_register() fails (Thierry Reding)
- Add i.MX7D compatible bindings to fix a warning from dtbs_check for
the imx6ul platform (Alexander Stein)
- Add sa8775p compatible to the QCom tsens driver (Priyansh Jain)
- Fix error check in lvts_debugfs_init() to be against PTR_ERR() in
the LVTS Mediatek driver (Minjie Du)
- Remove unused variable in thermal/tools (Kuan-Wei Chiu)
- Document the imx8dl thermal sensor (Fabio Estevam)
- Add variable names in callback prototypes to prevent warning from
checkpatch.pl in the imx8mm driver (Bragatheswaran Manickavel)
- Add missing unevaluatedProperties on child node schemas for
tegra124 (Rob Herring)
- Add mt7988 support to the Mediatek LVTS driver (Frank Wunderlich)"
* tag 'thermal-6.7-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: (111 commits)
thermal: ACPI: Include the right header file
thermal: core: Don't update trip points inside the hysteresis range
thermal: core: Pass trip pointer to governor throttle callback
thermal: gov_step_wise: Fold update_passive_instance() into its caller
thermal: gov_power_allocator: Use trip pointers instead of trip indices
thermal: gov_fair_share: Rearrange get_trip_level()
thermal: trip: Define for_each_trip() macro
thermal: trip: Simplify computing trip indices
thermal/qcom/tsens: Drop ops_v0_1
thermal/drivers/mediatek/lvts_thermal: Update calibration data documentation
thermal/drivers/mediatek/lvts_thermal: Add mt8192 support
thermal/drivers/mediatek/lvts_thermal: Add suspend and resume
dt-bindings: thermal: mediatek: Add LVTS thermal controller definition for mt8192
thermal/drivers/mediatek: Fix probe for THERMAL_V2
thermal/drivers/max77620: Remove duplicate error message
dt-bindings: timer: add imx7d compatible
dt-bindings: net: microchip: Allow nvmem-cell usage
dt-bindings: imx-thermal: Add #thermal-sensor-cells property
dt-bindings: thermal: tsens: Add sa8775p compatible
thermal/drivers/mediatek/lvts_thermal: Fix error check in lvts_debugfs_init()
...
Since the commit 6812d1dfbc ("thermal/drivers/qcom/tsens-v0_1: Fix
mdm9607 slope values") the default v0.1 implementation of tsens
options is unused by the driver. Drop it now to stop compiler
complaining about the unused static const. If it appears there is the
need for the default v0.1 ops struct, this commit can be easily
reverted without further considerations.
Fixes: 6812d1dfbc ("thermal/drivers/qcom/tsens-v0_1: Fix mdm9607 slope values")
Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20231019144311.1035181-1-dmitry.baryshkov@linaro.org
Prepare for the coming implementation by GCC and Clang of the __counted_by
attribute. Flexible array members annotated with __counted_by can have
their accesses bounds-checked at run-time checking via CONFIG_UBSAN_BOUNDS
(for array indexing) and CONFIG_FORTIFY_SOURCE (for strcpy/memcpy-family
functions).
As found with Coccinelle[1], add __counted_by for struct tsens_priv.
[1] https://github.com/kees/kernel-tools/blob/trunk/coccinelle/examples/counted_by.cocci
Cc: Andy Gross <agross@kernel.org>
Cc: Bjorn Andersson <andersson@kernel.org>
Cc: Konrad Dybcio <konrad.dybcio@linaro.org>
Cc: Amit Kucheria <amitk@kernel.org>
Cc: Thara Gopinath <thara.gopinath@gmail.com>
Cc: "Rafael J. Wysocki" <rafael@kernel.org>
Cc: Daniel Lezcano <daniel.lezcano@linaro.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-arm-msm@vger.kernel.org
Cc: linux-pm@vger.kernel.org
Reviewed-by: "Gustavo A. R. Silva" <gustavoars@kernel.org>
Link: https://lore.kernel.org/r/20230922175341.work.919-kees@kernel.org
Signed-off-by: Kees Cook <keescook@chromium.org>
The .remove() callback for a platform driver returns an int which makes
many driver authors wrongly assume it's possible to do error handling by
returning an error code. However the value returned is ignored (apart
from emitting a warning) and this typically results in resource leaks.
To improve here there is a quest to make the remove callback return
void. In the first step of this quest all drivers are converted to
.remove_new(), which already returns void. Eventually after all drivers
are converted, .remove_new() will be renamed to .remove().
Trivially convert this driver from always returning zero in the remove
callback to the void returning variant.
Signed-off-by: Uwe Kleine-König <u.kleine-koenig@pengutronix.de>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
This patch fixes the following sparse warnings:
drivers/thermal/qcom/tsens-v1.c:24:40: sparse: warning: symbol 'tsens_qcs404_nvmem' was not declared. Should it be static?
drivers/thermal/qcom/tsens-v0_1.c:26:40: sparse: warning: symbol 'tsens_8916_nvmem' was not declared. Should it be static?
drivers/thermal/qcom/tsens-v0_1.c:42:40: sparse: warning: symbol 'tsens_8974_nvmem' was not declared. Should it be static?
drivers/thermal/qcom/tsens-v0_1.c:64:40: sparse: warning: symbol 'tsens_8974_backup_nvmem' was not declared. Should it be static?
No functional change intended.
Signed-off-by: Min-Hua Chen <minhuadotchen@gmail.com>
Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230713160415.149381-1-minhuadotchen@gmail.com
The DT of_device.h and of_platform.h date back to the separate
of_platform_bus_type before it as merged into the regular platform bus.
As part of that merge prepping Arm DT support 13 years ago, they
"temporarily" include each other. They also include platform_device.h
and of.h. As a result, there's a pretty much random mix of those include
files used throughout the tree. In order to detangle these headers and
replace the implicit includes with struct declarations, users need to
explicitly include the correct includes.
Signed-off-by: Rob Herring <robh@kernel.org>
Reviewed-by: Alim Akhtar <alim.akhtar@samsung.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Use the dev_err_probe function instead of dev_err in the probe function
so that the printed message includes the return value and also handles
-EPROBE_DEFER nicely.
Signed-off-by: Luca Weiss <luca@z3ntu.xyz>
Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230625-spmi-temp-alarm-defer-v1-1-2d57acf36855@z3ntu.xyz
The upper-layer devm_thermal_add_hwmon_sysfs() function can directly
print error information.
Signed-off-by: Yangtao Li <frank.li@vivo.com>
Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230620090732.50025-9-frank.li@vivo.com
According to the msm-3.18 vendor kernel from Qualcomm, mdm9607 needs
"correction factors" to adjust for additional offsets observed after the
factory calibration values in the fuses [1, 2].
The fixed offsets should be applied unless there is a special
calibration mode value that indicates that no offsets are needed [3].
Note that the new calibration mode values are called differently in this
patch compared to the vendor kernel:
- TSENS_TWO_POINT_CALIB_N_WA -> ONE_PT_CALIB2_NO_OFFSET
- TSENS_TWO_POINT_CALIB_N_OFFSET_WA -> TWO_PT_CALIB_NO_OFFSET
This is because close inspection of the calibration function [3] reveals
that TSENS_TWO_POINT_CALIB_N_WA is actually a "one point" calibration
because the if statements skip all "point2" related code for it.
[1]: d9d2db1b82
[2]: d75aef53a7
[3]: https://git.codelinaro.org/clo/la/kernel/msm-3.18/-/blob/LE.UM.4.3.2.r1-04200-9x07/drivers/thermal/msm-tsens.c#L2987-3136
Fixes: a2149ab815 ("thermal/drivers/qcom/tsens-v0_1: Add support for MDM9607")
Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Signed-off-by: Stephan Gerhold <stephan.gerhold@kernkonzept.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230508-msm8909-tsens-v5-3-5eb632235ba7@kernkonzept.com
The old single-cell parsing code was removed for MSM8939, MDM9607 and
MSM8976 but for some reason the structs defining the bit positions etc
were kept around (unused). Drop them now.
Cc: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Fixes: 51d78b8b1b ("thermal/drivers/tsens: Drop single-cell code for mdm9607")
Fixes: dfadb4599a ("thermal/drivers/tsens: Drop single-cell code for msm8939")
Fixes: 3a908971f7 ("thermal/drivers/tsens: Drop single-cell code for msm8976/msm8956")
Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Signed-off-by: Stephan Gerhold <stephan.gerhold@kernkonzept.com>
Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230508-msm8909-tsens-v5-1-5eb632235ba7@kernkonzept.com
The MSM8226 TSENS IP has 6 thermal sensors in a TSENS v0.1 block.
The thermal sensors use non-standard slope values.
Signed-off-by: Matti Lehtimäki <matti.lehtimaki@gmail.com>
Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Reviewed-by: Luca Weiss <luca@z3ntu.xyz>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230507201225.89694-4-matti.lehtimaki@gmail.com
The devres variant of thermal_add_hwmon_sysfs() only takes the thermal
zone structure pointer as parameter.
Actually, it uses the tz->device to add it in the devres list.
It is preferable to use the device registering the thermal zone
instead of the thermal zone device itself. That prevents the driver
accessing the thermal zone structure internals and it is from my POV
more correct regarding how devm_ is used.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Martin Blumenstingl <martin.blumenstingl@googlemail.com> #amlogic_thermal
Acked-by: Jernej Skrabec <jernej.skrabec@gmail.com> #sun8i_thermal
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> #MediaTek auxadc
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The thermal zone device structure is exposed to the different drivers
and obviously they access the internals while that should be
restricted to the core thermal code.
In order to self-encapsulate the thermal core code, we need to prevent
the drivers accessing directly the thermal zone structure and provide
accessor functions to deal with.
Use the devdata accessor introduced in the previous patch.
No functional changes intended.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> #R-Car
Acked-by: Mark Brown <broonie@kernel.org>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> #MediaTek auxadc and lvts
Reviewed-by: Balsam CHIHI <bchihi@baylibre.com> #Mediatek lvts
Reviewed-by: Adam Ward <DLG-Adam.Ward.opensource@dm.renesas.com> #da9062
Reviewed-by: Baolin Wang <baolin.wang@linux.alibaba.com> #spread
Acked-by: Jernej Skrabec <jernej.skrabec@gmail.com> #sun8i_thermal
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Florian Fainelli <f.fainelli@gmail.com> #Broadcom
Reviewed-by: Dhruva Gole <d-gole@ti.com> # K3 bandgap
Acked-by: Linus Walleij <linus.walleij@linaro.org>
Acked-by: Heiko Stuebner <heiko@sntech.de> #rockchip
Reviewed-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com> #uniphier
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
As usual, there are lots of minor driver changes across SoC platforms
from NXP, Amlogic, AMD Zynq, Mediatek, Qualcomm, Apple and Samsung.
These usually add support for additional chip variations in existing
drivers, but also add features or bugfixes.
The SCMI firmware subsystem gains a unified raw userspace interface
through debugfs, which can be used for validation purposes.
Newly added drivers include:
- New power management drivers for StarFive JH7110, Allwinner D1 and
Renesas RZ/V2M
- A driver for Qualcomm battery and power supply status
- A SoC device driver for identifying Nuvoton WPCM450 chips
- A regulator coupler driver for Mediatek MT81xxv
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Merge tag 'soc-drivers-6.3' of git://git.kernel.org/pub/scm/linux/kernel/git/soc/soc
Pull ARM SoC driver updates from Arnd Bergmann:
"As usual, there are lots of minor driver changes across SoC platforms
from NXP, Amlogic, AMD Zynq, Mediatek, Qualcomm, Apple and Samsung.
These usually add support for additional chip variations in existing
drivers, but also add features or bugfixes.
The SCMI firmware subsystem gains a unified raw userspace interface
through debugfs, which can be used for validation purposes.
Newly added drivers include:
- New power management drivers for StarFive JH7110, Allwinner D1 and
Renesas RZ/V2M
- A driver for Qualcomm battery and power supply status
- A SoC device driver for identifying Nuvoton WPCM450 chips
- A regulator coupler driver for Mediatek MT81xxv"
* tag 'soc-drivers-6.3' of git://git.kernel.org/pub/scm/linux/kernel/git/soc/soc: (165 commits)
power: supply: Introduce Qualcomm PMIC GLINK power supply
soc: apple: rtkit: Do not copy the reg state structure to the stack
soc: sunxi: SUN20I_PPU should depend on PM
memory: renesas-rpc-if: Remove redundant division of dummy
soc: qcom: socinfo: Add IDs for IPQ5332 and its variant
dt-bindings: arm: qcom,ids: Add IDs for IPQ5332 and its variant
dt-bindings: power: qcom,rpmpd: add RPMH_REGULATOR_LEVEL_LOW_SVS_L1
firmware: qcom_scm: Move qcom_scm.h to include/linux/firmware/qcom/
MAINTAINERS: Update qcom CPR maintainer entry
dt-bindings: firmware: document Qualcomm SM8550 SCM
dt-bindings: firmware: qcom,scm: add qcom,scm-sa8775p compatible
soc: qcom: socinfo: Add Soc IDs for IPQ8064 and variants
dt-bindings: arm: qcom,ids: Add Soc IDs for IPQ8064 and variants
soc: qcom: socinfo: Add support for new field in revision 17
soc: qcom: smd-rpm: Add IPQ9574 compatible
soc: qcom: pmic_glink: remove redundant calculation of svid
soc: qcom: stats: Populate all subsystem debugfs files
dt-bindings: soc: qcom,rpmh-rsc: Update to allow for generic nodes
soc: qcom: pmic_glink: add CONFIG_NET/CONFIG_OF dependencies
soc: qcom: pmic_glink: Introduce altmode support
...
As the name states "thermal_core.h" is the header file for the core
components of the thermal framework.
Too many drivers are including it. Hopefully the recent cleanups
helped to self encapsulate the code a bit more and prevented the
drivers to need this header.
Remove this inclusion in every place where it is possible.
Some other drivers did a confusion with the core header and the one
exported in linux/thermal.h. They include the former instead of the
latter. The changes also fix this.
The tegra/soctherm driver still remains as it uses an internal
function which need to be replaced.
The Intel HFI driver uses the netlink internal framework core and
should be changed to prevent to deal with the internals.
No functional changes intended.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Miquel Raynal <miquel.raynal@bootlin.com> # armada_thermal.c
Reviewed-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com> # uniphier_thermal.c
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> # rcar_gen3_thermal.c
Reviewed-by: Neil Armstrong <neil.armstrong@linaro.org> # amlogic_thermal.c
Acked-by: Florian Fainelli <f.fainelli@gmail.com> # bcm2835_thermal.c
Acked-by: Thierry Reding <treding@nvidia.com> # tegra30-tsensor.c
Link: https://lore.kernel.org/r/20230206153432.1017282-1-daniel.lezcano@linaro.org
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Move include/linux/qcom_scm.h to include/linux/firmware/qcom/qcom_scm.h.
This removes 1 of a few remaining Qualcomm-specific headers into a more
approciate subdirectory under include/.
Suggested-by: Bjorn Andersson <andersson@kernel.org>
Signed-off-by: Elliot Berman <quic_eberman@quicinc.com>
Reviewed-by: Guru Das Srinagesh <quic_gurus@quicinc.com>
Acked-by: Mukesh Ojha <quic_mojha@quicinc.com>
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
Link: https://lore.kernel.org/r/20230203210956.3580811-1-quic_eberman@quicinc.com
There is no point to specify asm-generic for the unaligned.h.
Drop the 'generic' suffix.
Signed-off-by: Andy Shevchenko <andriy.shevchenko@linux.intel.com>
Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Link: https://lore.kernel.org/r/20230103145339.40501-1-andriy.shevchenko@linux.intel.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
The tsens driver reprogram the next trip points in the irq
handler. This function then call thermal_zone_device_update().
However, thermal_zone_device_update() calls thermal_zone_set_trips()
and from there it calls the backend 'set_trips' ops. This one in turn
reprogram the next trip points (low/high).
Consequently, the code setting the next trip points interrupt in the
interrupt handle is not needed and could be removed.
Reviewed-by: Bjorn Andersson <andersson@kernel.org>
Acked-by: Amit Kucheria <amitk@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230116101955.3961427-1-daniel.lezcano@linaro.org
There is no dtsi file for msm8976 in the kernel sources. Drop the
compatibility with unofficial dtsi and remove support for handling the
single-cell calibration data on msm8976.
Cc: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Link: https://lore.kernel.org/r/20230101194034.831222-15-dmitry.baryshkov@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
There is no dtsi file for msm8939 in the kernel sources. Drop the
compatibility with unofficial dtsi and remove support for handling the
single-cell calibration data on msm8939.
Cc: Shawn Guo <shawn.guo@linaro.org>
Cc: Bryan O'Donoghue <bryan.odonoghue@linaro.org>
Reviewed-by: Bryan O'Donoghue <bryan.odonoghue@linaro.org>
Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Acked-by: Shawn Guo <shawn.guo@linaro.org>
Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Link: https://lore.kernel.org/r/20230101194034.831222-14-dmitry.baryshkov@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
There is no dtsi file for mdm9607 in the kernel sources. Drop the
compatibility with unofficial dtsi and remove support for handling the
single-cell calibration data on mdm9607.
Cc: Konrad Dybcio <konrad.dybcio@linaro.org>
Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Link: https://lore.kernel.org/r/20230101194034.831222-13-dmitry.baryshkov@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Rework existing calibration parsing code to use simple data structure
describing data layout. This allows us to drop all the mask & shift
values, replacing them with data tables.
The code for msm8974 is not reworked, as it has separate calibration and
backup data.
Reported-by: kernel test robot <lkp@intel.com>
Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Link: https://lore.kernel.org/r/20230101194034.831222-12-dmitry.baryshkov@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
MSM8974 has two sets of calibration data: main one and backup. Add
support for parsing both sets of calibration data from nvmem cells.
Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Link: https://lore.kernel.org/r/20230101194034.831222-11-dmitry.baryshkov@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Add a unified function using nvmem cells for parsing the calibration
data rather than parsing the calibration blob manually.
Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Link: https://lore.kernel.org/r/20230101194034.831222-10-dmitry.baryshkov@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
On msm8939 last (hwid=10) sensor was added in the hw revision 3.0.
Calibration data for it was placed outside of the main calibration data
blob, so it is not accessible by the current blob-parsing code.
Moreover data for the sensor's p2 is not contiguous in the fuses. This
makes it hard to use nvmem_cell API to parse calibration data in a
generic way.
Since the sensor doesn't seem to be actually used by the existing
hardware, disable the sensor for now.
Fixes: 332bc8ebab ("thermal: qcom: tsens-v0_1: Add support for MSM8939")
Cc: Bryan O'Donoghue <bryan.odonoghue@linaro.org>
Cc: Shawn Guo <shawn.guo@linaro.org>
Acked-by: Shawn Guo <shawn.guo@linaro.org>
Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Reviewed-by: Bryan O'Donoghue <bryan.odonoghue@linaro.org>
Link: https://lore.kernel.org/r/20230101194034.831222-9-dmitry.baryshkov@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
According to the vendor kernels (msm-3.10, 3.14 and 3.18), msm8939
uses non-standard slope values for calibrating the sensors. Fill them
accordingly.
Fixes: 332bc8ebab ("thermal: qcom: tsens-v0_1: Add support for MSM8939")
Cc: Bryan O'Donoghue <bryan.odonoghue@linaro.org>
Cc: Shawn Guo <shawn.guo@linaro.org>
Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Acked-by: Shawn Guo <shawn.guo@linaro.org>
Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Reviewed-by: Bryan O'Donoghue <bryan.odonoghue@linaro.org>
Link: https://lore.kernel.org/r/20230101194034.831222-8-dmitry.baryshkov@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tsens driver mentions that msm8976 data should be used for both msm8976
and msm8956 SoCs. This is not quite correct, as according to the
vendor kernels, msm8976 should use standard slope values (3200), while
msm8956 really uses the slope values found in the driver.
Add separate compatibility string for msm8956, move slope value
overrides to the corresponding init function and use the standard
compute_intercept_slope() function for both platforms.
Fixes: 0e58029017 ("thermal: qcom: tsens-v1: Add support for MSM8956 and MSM8976")
Cc: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Link: https://lore.kernel.org/r/20230101194034.831222-7-dmitry.baryshkov@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Drop msm8976-specific defines, which duplicate generic ones.
Fixes: 0e58029017 ("thermal: qcom: tsens-v1: Add support for MSM8956 and MSM8976")
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Link: https://lore.kernel.org/r/20230101194034.831222-6-dmitry.baryshkov@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
The tsens driver defaults to using hw_id equal to the index of the
sensor. Thus it is superfluous to declare such hw_id arrays. Drop such
arrays from mdm9607 and msm8976 data.
Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Link: https://lore.kernel.org/r/20230101194034.831222-5-dmitry.baryshkov@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
The thermal-zone-device lock is held by core when setting trip points
and the driver takes its chip lock in the corresponding callback.
Fetching the thermal trip points using thermal_zone_get_trip() also
involves taking the thermal-zone-device lock, which means that the chip
lock can not be held when doing so.
Drop the chip lock temporarily during probe to avoid the lock inversion
that was detected by lockdep:
======================================================
WARNING: possible circular locking dependency detected
6.1.0-next-20221213 #122 Not tainted
------------------------------------------------------
systemd-udevd/264 is trying to acquire lock:
ffff741e444a0920 (&chip->lock){+.+.}-{3:3}, at: qpnp_tm_get_temp+0xb4/0x1b0 [qcom_spmi_temp_alarm]
but task is already holding lock:
ffff741e44341618 (&tz->lock){+.+.}-{3:3}, at: thermal_zone_device_update+0x2c/0x70
which lock already depends on the new lock.
Fixes: 78c3e2429be8 ("thermal/drivers/qcom: Use generic thermal_zone_get_trip() function")
Signed-off-by: Johan Hovold <johan+linaro@kernel.org>
Link: https://lore.kernel.org/r/20221214131617.2447-5-johan+linaro@kernel.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
The set_trip_temp() callback is used when changing the trip temperature
through sysfs. As it is called with the thermal-zone-device lock held
it must not use thermal_zone_get_trip() directly or it will deadlock.
Fixes: 78c3e2429be8 ("thermal/drivers/qcom: Use generic thermal_zone_get_trip() function")
Signed-off-by: Johan Hovold <johan+linaro@kernel.org>
Link: https://lore.kernel.org/r/20221214131617.2447-2-johan+linaro@kernel.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
The thermal framework gives the possibility to register the trip
points with the thermal zone. When that is done, no get_trip_* ops are
needed and they can be removed.
Convert ops content logic into generic trip points and register them with the
thermal zone.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Amit Kucheria <amitk@kernel.org>
Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Link: https://lore.kernel.org/r/20221003092602.1323944-14-daniel.lezcano@linaro.org
After enough invocations the LMh irq is eventually reported as bad, because the
handler doesn't return IRQ_HANDLED, fix this.
Fixes: 53bca371cd ("thermal/drivers/qcom: Add support for LMh driver")
Reported-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Link: https://lore.kernel.org/r/20220316180322.88132-1-bjorn.andersson@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
devm_thermal_of_zone_register() can fail with -ENODEV if thermal zone for
the channel is not represented in DT. This is perfectly fine since not all
sensors needs to be used for thermal zones but only a few in real world.
So demote the error log to debug to avoid spamming users.
Signed-off-by: Manivannan Sadhasivam <manivannan.sadhasivam@linaro.org>
Link: https://lore.kernel.org/r/20221029052933.32421-1-manivannan.sadhasivam@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
On gen2 chips the stage2 threshold is not 140 degC but 125 degC.
Make the warning message clearer by using this variable and also by
including the temperature that was checked for.
Fixes: aa92b3310c ("thermal/drivers/qcom-spmi-temp-alarm: Add support for GEN2 rev 1 PMIC peripherals")
Signed-off-by: Luca Weiss <luca.weiss@fairphone.com>
Reviewed-by: Amit Kucheria <amitk@kernel.org>
Link: https://lore.kernel.org/r/20221020145237.942146-1-luca.weiss@fairphone.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Drivers should not be logging errors on probe deferral. Switch to using
dev_err_probe() to log failures when parsing the devicetree to avoid
errors like:
qcom-spmi-adc-tm5 c440000.spmi:pmic@0:adc-tm@3400: get dt data failed: -517
when a channel is not yet available.
Signed-off-by: Johan Hovold <johan+linaro@kernel.org>
Reviewed-by: Manivannan Sadhasivam <mani@kernel.org>
Reviewed-by: Andrew Halaney <ahalaney@redhat.com>
Link: https://lore.kernel.org/r/20221102152630.696-1-johan+linaro@kernel.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
The current tsens debugfs structure is composed by:
- a tsens dir in debugfs with a version file
- a directory for each tsens istance with sensors file to dump all the
sensors value.
This works on the assumption that we have the same version for each
istance but this assumption seems fragile and with more than one tsens
istance results in the version file not tracking each of them.
A better approach is to just create a subdirectory for each tsens
istance and put there version and sensors debugfs file.
Using this new implementation results in less code since debugfs entry
are created only on successful tsens probe.
Signed-off-by: Christian Marangi <ansuelsmth@gmail.com>
Link: https://lore.kernel.org/r/20221022125657.22530-4-ansuelsmth@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
For VER_0 the version was incorrectly reported as 0.1.0.
Fix that and correctly report the major version for this old tsens
revision.
Signed-off-by: Christian Marangi <ansuelsmth@gmail.com>
Link: https://lore.kernel.org/r/20221022125657.22530-3-ansuelsmth@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Calibrate and tsens_register can fail or PROBE_DEFER. This will cause a
double or a wrong init of the debugfs information. Init debugfs only
with successful probe fixing warning about directory already present.
Signed-off-by: Christian Marangi <ansuelsmth@gmail.com>
Acked-by: Thara Gopinath <thara.gopinath@linaro.org>
Link: https://lore.kernel.org/r/20221022125657.22530-2-ansuelsmth@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Qualcomm IPQ8074 uses tsens v2.3 IP, however unlike other tsens v2 IP
it only has one IRQ, that is used for up/low as well as critical.
It also does not support negative trip temperatures.
Signed-off-by: Robert Marko <robimarko@gmail.com>
Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Link: https://lore.kernel.org/r/20220818220245.338396-4-robimarko@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
IPQ8074 and IPQ6018 dont support negative trip temperatures and support
up to 204 degrees C as the max trip temperature.
So, instead of always setting the -40 as min and 120 degrees C as max
allow it to be configured as part of the features.
Signed-off-by: Robert Marko <robimarko@gmail.com>
Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Link: https://lore.kernel.org/r/20220818220245.338396-3-robimarko@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Despite using tsens v2.3 IP, IPQ8074 and IPQ6018 only have one IRQ for
signaling both up/low and critical trips.
Signed-off-by: Robert Marko <robimarko@gmail.com>
Reviewed-by: Bjorn Andersson <andersson@kernel.org>
Link: https://lore.kernel.org/r/20220818220245.338396-2-robimarko@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
- Use platform data to get the sensor ID instead of parsing the device
in imx_sc thermal driver and remove the dedicated OF function from
the core code (Daniel Lezcano).
- Fix Kconfig dependency for the QCom tsens thermal driver (Jonathan
Cameron).
- Add missing const annotation to the RCar ops thermal driver (Lad
Prabhakar).
- Drop duplicate parameter check from
thermal_zone_device_register_with_trips() (Lad Prabhakar).
- Fix NULL pointer dereference in trip_point_temp_store() by making it
check if the ->set_trip_temp() operation is present (Lad Prabhakar).
- Fix the MSM8939 fourth sensor hardware ID in the QCom tsens thermal
driver (Vincent Knecht).
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Merge tag 'thermal-6.1-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm
Pull more thermal control updates from Rafael Wysocki:
"These fix assorted issues in the thermal core and ARM thermal drivers.
Specifics:
- Use platform data to get the sensor ID instead of parsing the
device in imx_sc thermal driver and remove the dedicated OF
function from the core code (Daniel Lezcano).
- Fix Kconfig dependency for the QCom tsens thermal driver (Jonathan
Cameron).
- Add missing const annotation to the RCar ops thermal driver (Lad
Prabhakar).
- Drop duplicate parameter check from
thermal_zone_device_register_with_trips() (Lad Prabhakar).
- Fix NULL pointer dereference in trip_point_temp_store() by making
it check if the ->set_trip_temp() operation is present (Lad
Prabhakar).
- Fix the MSM8939 fourth sensor hardware ID in the QCom tsens thermal
driver (Vincent Knecht)"
* tag 'thermal-6.1-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm:
thermal/drivers/qcom/tsens-v0_1: Fix MSM8939 fourth sensor hw_id
thermal/core: Add a check before calling set_trip_temp()
thermal/core: Drop valid pointer check for type
thermal/drivers/rcar_thermal: Constify static thermal_zone_device_ops
thermal/drivers/qcom: Drop false build dependency of all QCOM drivers on QCOM_TSENS
thermal/of: Remove the thermal_zone_of_get_sensor_id() function
thermal/drivers/imx_sc: Rely on the platform data to get the resource id
Here is the large set of char/misc and other small driver subsystem
changes for 6.1-rc1. Loads of different things in here:
- IIO driver updates, additions, and changes. Probably the largest
part of the diffstat
- habanalabs driver update with support for new hardware and features,
the second largest part of the diff.
- fpga subsystem driver updates and additions
- mhi subsystem updates
- Coresight driver updates
- gnss subsystem updates
- extcon driver updates
- icc subsystem updates
- fsi subsystem updates
- nvmem subsystem and driver updates
- misc driver updates
- speakup driver additions for new features
- lots of tiny driver updates and cleanups
All of these have been in the linux-next tree for a while with no
reported issues.
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
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Merge tag 'char-misc-6.1-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/gregkh/char-misc
Pull char/misc and other driver updates from Greg KH:
"Here is the large set of char/misc and other small driver subsystem
changes for 6.1-rc1. Loads of different things in here:
- IIO driver updates, additions, and changes. Probably the largest
part of the diffstat
- habanalabs driver update with support for new hardware and
features, the second largest part of the diff.
- fpga subsystem driver updates and additions
- mhi subsystem updates
- Coresight driver updates
- gnss subsystem updates
- extcon driver updates
- icc subsystem updates
- fsi subsystem updates
- nvmem subsystem and driver updates
- misc driver updates
- speakup driver additions for new features
- lots of tiny driver updates and cleanups
All of these have been in the linux-next tree for a while with no
reported issues"
* tag 'char-misc-6.1-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/gregkh/char-misc: (411 commits)
w1: Split memcpy() of struct cn_msg flexible array
spmi: pmic-arb: increase SPMI transaction timeout delay
spmi: pmic-arb: block access for invalid PMIC arbiter v5 SPMI writes
spmi: pmic-arb: correct duplicate APID to PPID mapping logic
spmi: pmic-arb: add support to dispatch interrupt based on IRQ status
spmi: pmic-arb: check apid against limits before calling irq handler
spmi: pmic-arb: do not ack and clear peripheral interrupts in cleanup_irq
spmi: pmic-arb: handle spurious interrupt
spmi: pmic-arb: add a print in cleanup_irq
drivers: spmi: Directly use ida_alloc()/free()
MAINTAINERS: add TI ECAP driver info
counter: ti-ecap-capture: capture driver support for ECAP
Documentation: ABI: sysfs-bus-counter: add frequency & num_overflows items
dt-bindings: counter: add ti,am62-ecap-capture.yaml
counter: Introduce the COUNTER_COMP_ARRAY component type
counter: Consolidate Counter extension sysfs attribute creation
counter: Introduce the Count capture component
counter: 104-quad-8: Add Signal polarity component
counter: Introduce the Signal polarity component
counter: interrupt-cnt: Implement watch_validate callback
...
The print function dev_err() is redundant because platform_get_irq()
already prints an error.
./drivers/thermal/qcom/qcom-spmi-adc-tm5.c:1029:2-9: line 1029 is redundant because platform_get_irq() already prints an error.
Link: https://bugzilla.openanolis.cn/show_bug.cgi?id=1846
Reported-by: Abaci Robot <abaci@linux.alibaba.com>
Signed-off-by: Jiapeng Chong <jiapeng.chong@linux.alibaba.com>
Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Link: https://lore.kernel.org/r/20220809034346.128607-1-jiapeng.chong@linux.alibaba.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
The thermal OF code has a new API allowing to migrate the OF
initialization to a simpler approach. The ops are no longer device
tree specific and are the generic ones provided by the core code.
Convert the ops to the thermal_zone_device_ops format and use the new
API to register the thermal zone with these generic ops.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linexp.org>
Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Link: https://lore.kernel.org/r/20220804224349.1926752-12-daniel.lezcano@linexp.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
