linux/Documentation/devicetree/bindings/vendor-prefixes.txt
Linus Torvalds 10d0c9705e DeviceTree updates for 3.13. This is a bit larger pull request than
usual for this cycle with lots of clean-up.
 
 - Cross arch clean-up and consolidation of early DT scanning code.
 - Clean-up and removal of arch prom.h headers. Makes arch specific
   prom.h optional on all but Sparc.
 - Addition of interrupts-extended property for devices connected to
   multiple interrupt controllers.
 - Refactoring of DT interrupt parsing code in preparation for deferred
   probe of interrupts.
 - ARM cpu and cpu topology bindings documentation.
 - Various DT vendor binding documentation updates.
 -----BEGIN PGP SIGNATURE-----
 Version: GnuPG v1.4.12 (GNU/Linux)
 
 iQEcBAABAgAGBQJSgPQ4AAoJEMhvYp4jgsXif28H/1WkrXq5+lCFQZF8nbYdE2h0
 R8PsfiJJmAl6/wFgQTsRel+ScMk2hiP08uTyqf2RLnB1v87gCF7MKVaLOdONfUDi
 huXbcQGWCmZv0tbBIklxJe3+X3FIJch4gnyUvPudD1m8a0R0LxWXH/NhdTSFyB20
 PNjhN/IzoN40X1PSAhfB5ndWnoxXBoehV/IVHVDU42vkPVbVTyGAw5qJzHW8CLyN
 2oGTOalOO4ffQ7dIkBEQfj0mrgGcODToPdDvUQyyGZjYK2FY2sGrjyquir6SDcNa
 Q4gwatHTu0ygXpyphjtQf5tc3ZCejJ/F0s3olOAS1ahKGfe01fehtwPRROQnCK8=
 =GCbY
 -----END PGP SIGNATURE-----

Merge tag 'devicetree-for-3.13' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux

Pull devicetree updates from Rob Herring:
 "DeviceTree updates for 3.13.  This is a bit larger pull request than
  usual for this cycle with lots of clean-up.

   - Cross arch clean-up and consolidation of early DT scanning code.
   - Clean-up and removal of arch prom.h headers.  Makes arch specific
     prom.h optional on all but Sparc.
   - Addition of interrupts-extended property for devices connected to
     multiple interrupt controllers.
   - Refactoring of DT interrupt parsing code in preparation for
     deferred probe of interrupts.
   - ARM cpu and cpu topology bindings documentation.
   - Various DT vendor binding documentation updates"

* tag 'devicetree-for-3.13' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (82 commits)
  powerpc: add missing explicit OF includes for ppc
  dt/irq: add empty of_irq_count for !OF_IRQ
  dt: disable self-tests for !OF_IRQ
  of: irq: Fix interrupt-map entry matching
  MIPS: Netlogic: replace early_init_devtree() call
  of: Add Panasonic Corporation vendor prefix
  of: Add Chunghwa Picture Tubes Ltd. vendor prefix
  of: Add AU Optronics Corporation vendor prefix
  of/irq: Fix potential buffer overflow
  of/irq: Fix bug in interrupt parsing refactor.
  of: set dma_mask to point to coherent_dma_mask
  of: add vendor prefix for PHYTEC Messtechnik GmbH
  DT: sort vendor-prefixes.txt
  of: Add vendor prefix for Cadence
  of: Add empty for_each_available_child_of_node() macro definition
  arm/versatile: Fix versatile irq specifications.
  of/irq: create interrupts-extended property
  microblaze/pci: Drop PowerPC-ism from irq parsing
  of/irq: Create of_irq_parse_and_map_pci() to consolidate arch code.
  of/irq: Use irq_of_parse_and_map()
  ...
2013-11-12 16:52:17 +09:00

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Device tree binding vendor prefix registry. Keep list in alphabetical order.
This isn't an exhaustive list, but you should add new prefixes to it before
using them to avoid name-space collisions.
ad Avionic Design GmbH
adi Analog Devices, Inc.
aeroflexgaisler Aeroflex Gaisler AB
ak Asahi Kasei Corp.
altr Altera Corp.
amcc Applied Micro Circuits Corporation (APM, formally AMCC)
apm Applied Micro Circuits Corporation (APM)
arm ARM Ltd.
atmel Atmel Corporation
auo AU Optronics Corporation
avago Avago Technologies
bosch Bosch Sensortec GmbH
brcm Broadcom Corporation
capella Capella Microsystems, Inc
cavium Cavium, Inc.
cdns Cadence Design Systems Inc.
chrp Common Hardware Reference Platform
chunghwa Chunghwa Picture Tubes Ltd.
cirrus Cirrus Logic, Inc.
cortina Cortina Systems, Inc.
dallas Maxim Integrated Products (formerly Dallas Semiconductor)
davicom DAVICOM Semiconductor, Inc.
denx Denx Software Engineering
emmicro EM Microelectronic
epson Seiko Epson Corp.
est ESTeem Wireless Modems
fsl Freescale Semiconductor
GEFanuc GE Fanuc Intelligent Platforms Embedded Systems, Inc.
gef GE Fanuc Intelligent Platforms Embedded Systems, Inc.
hisilicon Hisilicon Limited.
hp Hewlett Packard
ibm International Business Machines (IBM)
idt Integrated Device Technologies, Inc.
img Imagination Technologies Ltd.
intercontrol Inter Control Group
linux Linux-specific binding
lsi LSI Corp. (LSI Logic)
marvell Marvell Technology Group Ltd.
maxim Maxim Integrated Products
microchip Microchip Technology Inc.
mosaixtech Mosaix Technologies, Inc.
national National Semiconductor
nintendo Nintendo
nvidia NVIDIA
nxp NXP Semiconductors
onnn ON Semiconductor Corp.
panasonic Panasonic Corporation
phytec PHYTEC Messtechnik GmbH
picochip Picochip Ltd
powervr PowerVR (deprecated, use img)
qca Qualcomm Atheros, Inc.
qcom Qualcomm, Inc.
ralink Mediatek/Ralink Technology Corp.
ramtron Ramtron International
realtek Realtek Semiconductor Corp.
renesas Renesas Electronics Corporation
samsung Samsung Semiconductor
sbs Smart Battery System
schindler Schindler
sil Silicon Image
silabs Silicon Laboratories
simtek
sirf SiRF Technology, Inc.
snps Synopsys, Inc.
st STMicroelectronics
ste ST-Ericsson
stericsson ST-Ericsson
ti Texas Instruments
toshiba Toshiba Corporation
toumaz Toumaz
v3 V3 Semiconductor
via VIA Technologies, Inc.
winbond Winbond Electronics corp.
wlf Wolfson Microelectronics
wm Wondermedia Technologies, Inc.
xlnx Xilinx