linux/drivers/usb/dwc3/Makefile
Anton Tikhomirov d28a9689c9 usb: dwc3: Add Exynos Specific Glue layer
Adds Exynos Specific Glue layer to support USB peripherals
on Samsung Exynos5 chips.

[ balbi@ti.com : prevent compilation of Exynos glue layer
	on platforms which don't provide clk API implementation ]

Signed-off-by: Anton Tikhomirov <av.tikhomirov@samsung.com>
Signed-off-by: Felipe Balbi <balbi@ti.com>
2012-03-02 12:11:28 +02:00

48 lines
1.3 KiB
Makefile

ccflags-$(CONFIG_USB_DWC3_DEBUG) := -DDEBUG
ccflags-$(CONFIG_USB_DWC3_VERBOSE) += -DVERBOSE_DEBUG
obj-$(CONFIG_USB_DWC3) += dwc3.o
dwc3-y := core.o
dwc3-y += host.o
dwc3-y += gadget.o ep0.o
ifneq ($(CONFIG_DEBUG_FS),)
dwc3-y += debugfs.o
endif
##
# Platform-specific glue layers go here
#
# NOTICE: Make sure your glue layer doesn't depend on anything
# which is arch-specific and that it compiles on all situations.
#
# We want to keep this requirement in order to be able to compile
# the entire driver (with all its glue layers) on several architectures
# and make sure it compiles fine. This will also help with allmodconfig
# and allyesconfig builds.
#
# The only exception is the PCI glue layer, but that's only because
# PCI doesn't provide nops if CONFIG_PCI isn't enabled.
##
obj-$(CONFIG_USB_DWC3) += dwc3-omap.o
##
# REVISIT Samsung Exynos platform needs the clk API which isn't
# defined on all architectures. If we allow dwc3-exynos.c compile
# always we will fail the linking phase on those architectures
# which don't provide clk api implementation and that's unnaceptable.
#
# When Samsung's platform start supporting pm_runtime, this check
# for HAVE_CLK should be removed.
##
ifneq ($(CONFIG_HAVE_CLK),)
obj-$(CONFIG_USB_DWC3) += dwc3-exynos.o
endif
ifneq ($(CONFIG_PCI),)
obj-$(CONFIG_USB_DWC3) += dwc3-pci.o
endif