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9150820c88
Use tc filter to check if LACP was sent, which is accurate and save more time. No need to remove bonding module as some test env may buildin bonding. And the bond link has been deleted. Reviewed-by: Przemek Kitszel <przemyslaw.kitszel@intel.com> Signed-off-by: Hangbin Liu <liuhangbin@gmail.com> Link: https://lore.kernel.org/r/20240205130048.282087-3-liuhangbin@gmail.com Signed-off-by: Jakub Kicinski <kuba@kernel.org> |
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| .. | ||
| accounting | ||
| arch | ||
| bootconfig | ||
| bpf | ||
| build | ||
| certs | ||
| cgroup | ||
| counter | ||
| crypto | ||
| debugging | ||
| edid | ||
| firewire | ||
| firmware | ||
| gpio | ||
| hv | ||
| iio | ||
| include | ||
| kvm/kvm_stat | ||
| laptop | ||
| leds | ||
| lib | ||
| memory-model | ||
| mm | ||
| net/ynl | ||
| objtool | ||
| pci | ||
| pcmcia | ||
| perf | ||
| power | ||
| rcu | ||
| scripts | ||
| spi | ||
| testing | ||
| thermal | ||
| time | ||
| tracing | ||
| usb | ||
| verification | ||
| virtio | ||
| wmi | ||
| workqueue | ||
| Makefile | ||