Bob Moore 3278675567 ACPICA: Rename nameseg length macro/define for clarity ... ACPICA commit 24870bd9e73d71e2a1ff0a1e94519f8f8409e57d ACPI_NAME_SIZE changed to ACPI_NAMESEG_SIZE This clarifies that this is the length of an individual nameseg, not the length of a generic namestring/namepath. Improves understanding of the code. Link: https://github.com/acpica/acpica/commit/24870bd9 Signed-off-by: Bob Moore <robert.moore@intel.com> Signed-off-by: Erik Schmauss <erik.schmauss@intel.com> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>		2019-04-09 11:24:48 +02:00
..
broadcom	thermal: bcm2835: Fix crash in bcm2835_thermal_debugfs	2019-03-18 22:11:06 +08:00
intel	ACPICA: Rename nameseg length macro/define for clarity	2019-04-09 11:24:48 +02:00
qcom	thermal/qcom/tsens-common : fix possible object reference leak	2019-02-20 17:23:39 -08:00
samsung	thermal: samsung: Fix incorrect check after code merge	2019-03-18 22:11:06 +08:00
st	Merge branch 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux	2019-01-05 16:07:28 -08:00
tegra	thermal: tegra: add get_trend ops	2019-02-20 17:23:38 -08:00
ti-soc-thermal	thermal: ti-soc-thermal: remove dead code	2018-07-27 14:43:01 -07:00
armada_thermal.c	Merge branch 'linus' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal	2019-01-05 16:01:16 -08:00
clock_cooling.c
cpu_cooling.c	thermal: cpu_cooling: Remove unused cur_freq variable	2019-03-18 22:11:06 +08:00
da9062-thermal.c	thermal: da9062/61: Prevent hardware access during system suspend	2018-10-25 10:44:55 -07:00
db8500_thermal.c
devfreq_cooling.c
dove_thermal.c
fair_share.c
gov_bang_bang.c
hisi_thermal.c	thermal/drivers/hisi: Fix number of sensors on hi3660	2018-12-10 20:13:09 -08:00
imx_thermal.c	thermal: imx: save one condition block for normal case of nvmem initialization	2019-01-02 04:47:12 -08:00
Kconfig	Merge branch 'linus' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal	2019-03-08 09:52:41 -08:00
kirkwood_thermal.c
Makefile	drivers: thermal: Move QCOM_SPMI_TEMP_ALARM into the qcom subdir	2018-12-07 16:49:02 +08:00
max77620_thermal.c
mtk_thermal.c	thermal: mtk: Allocate enough space for mtk_thermal.	2019-03-18 22:23:10 +08:00
of-thermal.c	thermal: of-thermal: Print name of device node with error	2019-02-05 15:49:34 -08:00
power_allocator.c
qoriq_thermal.c	thermal: qoriq: add multiple sensors support	2019-02-05 16:36:26 -08:00
rcar_gen3_thermal.c	thermal: rcar_gen3_thermal: Register hwmon sysfs interface	2019-02-20 17:23:40 -08:00
rcar_thermal.c	thermal: rcar_thermal: add R8A77990 support	2019-01-02 04:47:22 -08:00
rockchip_thermal.c	thermal: rockchip_thermal: simplify getting .driver_data	2018-11-30 16:46:56 +08:00
spear_thermal.c	thermal: spear_thermal: simplify getting .driver_data	2018-11-30 16:46:56 +08:00
step_wise.c
tango_thermal.c
thermal-generic-adc.c	thermal: generic-adc: Fix adc to temp interpolation	2019-01-02 04:47:23 -08:00
thermal_core.c	Thermal: do not clear passive state during system sleep	2018-11-30 16:53:13 +08:00
thermal_core.h	drivers: thermal: Update license to SPDX format	2018-05-30 14:46:17 +08:00
thermal_helpers.c	drivers: thermal: Update license to SPDX format	2018-05-30 14:46:17 +08:00
thermal_hwmon.c	thermal_hwmon: Pass the originating device down to hwmon_device_register_with_info	2018-07-27 14:43:21 -07:00
thermal_hwmon.h	thermal: hwmon: inline helpers when CONFIG_THERMAL_HWMON is not set	2019-01-02 04:43:00 -08:00
thermal_sysfs.c	thermal: Fix locking in cooling device sysfs update cur_state	2018-11-30 16:57:51 +08:00
uniphier_thermal.c	thermal: uniphier: Convert to SPDX identifier	2019-01-02 04:47:16 -08:00
user_space.c
zx2967_thermal.c	thermal: zx2967_thermal: simplify getting .driver_data	2018-11-30 16:46:57 +08:00