- Add new IOCTLs to the int340x thermal driver to allow user space to
retrieve the Passive v2 thermal table (Srinivas Pandruvada).
- Add DT bindings for SM6375, MSM8226 and QCM2290 Qcom platforms (Konrad
Dybcio).
- Add DT bindings and support for QCom MSM8226 (Matti Lehtimäki).
- Add DT bindings for QCom ipq9574 (Praveenkumar I).
- Convert bcm2835 DT bindings to the yaml schema (Stefan Wahren).
- Allow selecting the bang-bang governor as default (Thierry Reding).
- Refactor and prepare the code to set the scene for RCar Gen4 (Wolfram
Sang).
- Clean up and fix the QCom tsens drivers. Add DT bindings and
calibration for the MSM8909 platform (Stephan Gerhold).
- Revert a patch introducing a wrong usage of devm_of_iomap() on the
Mediatek platform (Ricardo Cañuelo).
- Fix the clock vs reset ordering in order to conform to the
documentation on the sun8i (Christophe JAILLET).
- Prevent setting up undocumented registers, enable the only described
sensors and add the version 2.1 on the Qoriq sensor (Peng Fan).
- Add DT bindings and support for the Armada AP807 (Alex Leibovich).
- Update the mlx5 driver with the recent thermal changes (Daniel
Lezcano).
- Convert to platform remove callback returning void on STM32 (Uwe
Kleine-König).
- Add an error information printing for devm_thermal_add_hwmon_sysfs()
and remove the error from the Sun8i, Amlogic, i.MX, TI, K3, Tegra,
Qoriq, Mediateka and QCom (Yangtao Li).
- Register as hwmon sensor for the Generic ADC (Chen-Yu Tsai).
- Use the dev_err_probe() function in the QCom tsens alarm driver (Luca
Weiss).
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Merge tag 'thermal-6.5-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm
Pull thermal control updates from Rafael Wysocki:
"These extend the int340x thermal driver, add thermal DT bindings for
some Qcom platforms, add DT bindings and support for Armada AP807 and
MSM8909, allow selecting the bang-bang thermal governor as the default
one, address issues in several thermal drivers for ARM platforms and
clean up code.
Specifics:
- Add new IOCTLs to the int340x thermal driver to allow user space to
retrieve the Passive v2 thermal table (Srinivas Pandruvada)
- Add DT bindings for SM6375, MSM8226 and QCM2290 Qcom platforms
(Konrad Dybcio)
- Add DT bindings and support for QCom MSM8226 (Matti Lehtimäki)
- Add DT bindings for QCom ipq9574 (Praveenkumar I)
- Convert bcm2835 DT bindings to the yaml schema (Stefan Wahren)
- Allow selecting the bang-bang governor as default (Thierry Reding)
- Refactor and prepare the code to set the scene for RCar Gen4
(Wolfram Sang)
- Clean up and fix the QCom tsens drivers. Add DT bindings and
calibration for the MSM8909 platform (Stephan Gerhold)
- Revert a patch introducing a wrong usage of devm_of_iomap() on the
Mediatek platform (Ricardo Cañuelo)
- Fix the clock vs reset ordering in order to conform to the
documentation on the sun8i (Christophe JAILLET)
- Prevent setting up undocumented registers, enable the only
described sensors and add the version 2.1 on the Qoriq sensor (Peng
Fan)
- Add DT bindings and support for the Armada AP807 (Alex Leibovich)
- Update the mlx5 driver with the recent thermal changes (Daniel
Lezcano)
- Convert to platform remove callback returning void on STM32 (Uwe
Kleine-König)
- Add an error information printing for devm_thermal_add_hwmon_sysfs()
and remove the error from the Sun8i, Amlogic, i.MX, TI, K3, Tegra,
Qoriq, Mediateka and QCom (Yangtao Li)
- Register as hwmon sensor for the Generic ADC (Chen-Yu Tsai)
- Use the dev_err_probe() function in the QCom tsens alarm driver
(Luca Weiss)"
* tag 'thermal-6.5-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: (39 commits)
thermal/drivers/qcom/temp-alarm: Use dev_err_probe
thermal/drivers/generic-adc: Register thermal zones as hwmon sensors
thermal/drivers/mediatek/lvts_thermal: Remove redundant msg in lvts_ctrl_start()
thermal/drivers/qcom: Remove redundant msg at probe time
thermal/drivers/ti-soc: Remove redundant msg in ti_thermal_expose_sensor()
thermal/drivers/qoriq: Remove redundant msg in qoriq_tmu_register_tmu_zone()
thermal/drivers/tegra: Remove redundant msg in tegra_tsensor_register_channel()
drivers/thermal/k3: Remove redundant msg in k3_bandgap_probe()
thermal/drivers/imx: Remove redundant msg in imx8mm_tmu_probe() and imx_sc_thermal_probe()
thermal/drivers/amlogic: Remove redundant msg in amlogic_thermal_probe()
thermal/drivers/sun8i: Remove redundant msg in sun8i_ths_register()
thermal/hwmon: Add error information printing for devm_thermal_add_hwmon_sysfs()
thermal/drivers/stm32: Convert to platform remove callback returning void
net/mlx5: Update the driver with the recent thermal changes
thermal/drivers/armada: Add support for AP807 thermal data
dt-bindings: armada-thermal: Add armada-ap807-thermal compatible
thermal/drivers/qoriq: Support version 2.1
thermal/drivers/qoriq: Only enable supported sensors
thermal/drivers/qoriq: No need to program site adjustment register
thermal/drivers/mediatek/lvts_thermal: Register thermal zones as hwmon sensors
...
- Introduce power capping core support for Intel TPMI (Topology Aware
Register and PM Capsule Interface) and a TPMI interface driver for
Intel RAPL (Zhang Rui, Dan Carpenter).
- Fix CONFIG_IOSF_MBI dependency in the Intel RAPL power capping
driver (Zhang Rui).
- Fix invalid initialization for pl4_supported field in the Intel RAPL
power capping driver (Sumeet Pawnikar).
- Clean up the intel_idle driver, make it work with VM guests that
cannot use the MWAIT instruction and address the case in which the
host may enter a deep idle state when the guest is idle (Arjan van
de Ven).
- Prevent cpufreq drivers that provide the ->adjust_perf() callback
without a ->fast_switch() one which is used as a fallback from the
former in some cases (Wyes Karny).
- Fix some issues related to the AMD P-state cpufreq driver (Mario
Limonciello, Wyes Karny).
- Fix the energy_performance_preference attribute handling in the
intel_pstate driver in passive mode (Tero Kristo).
- Fix the handling of pm_suspend_target_state when CONFIG_PM is unset
(Kai-Heng Feng).
- Correct spelling mistake in a comment in the hibernation code (Wang
Honghui).
- Add arch_resume_nosmt() prototype to avoid a "missing prototypes"
build warning (Arnd Bergmann).
- Restrict pm_pr_dbg() to system-wide power transitions and use it in
a few additional places (Mario Limonciello).
- Drop verification of in-params from genpd_add_device() and ensure
that all of its callers will do it (Ulf Hansson).
- Prevent possible integer overflows from occurring in
genpd_parse_state() (Nikita Zhandarovich).
- Reorder fieldls in 'struct devfreq_dev_status' to reduce its size
somewhat (Christophe JAILLET).
- Ensure that the Exynos PPMU driver is already loaded before the
Exynos Bus driver starts probing so as to avoid a possible freeze
loading of the kernel modules (Marek Szyprowski).
- Fix variable deferencing before NULL check in the mtk-cci devfreq
driver (Sukrut Bellary).
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Merge tag 'pm-6.5-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm
Pull power management updates from Rafael Wysocki:
"These add Intel TPMI (Topology Aware Register and PM Capsule
Interface) support to the power capping subsystem, extend the
intel_idle driver to work in VM guests where MWAIT is not available,
extend the system-wide power management diagnostics, fix bugs and
clean up code.
Specifics:
- Introduce power capping core support for Intel TPMI (Topology Aware
Register and PM Capsule Interface) and a TPMI interface driver for
Intel RAPL (Zhang Rui, Dan Carpenter)
- Fix CONFIG_IOSF_MBI dependency in the Intel RAPL power capping
driver (Zhang Rui)
- Fix invalid initialization for pl4_supported field in the Intel
RAPL power capping driver (Sumeet Pawnikar)
- Clean up the intel_idle driver, make it work with VM guests that
cannot use the MWAIT instruction and address the case in which the
host may enter a deep idle state when the guest is idle (Arjan van
de Ven)
- Prevent cpufreq drivers that provide the ->adjust_perf() callback
without a ->fast_switch() one which is used as a fallback from the
former in some cases (Wyes Karny)
- Fix some issues related to the AMD P-state cpufreq driver (Mario
Limonciello, Wyes Karny)
- Fix the energy_performance_preference attribute handling in the
intel_pstate driver in passive mode (Tero Kristo)
- Fix the handling of pm_suspend_target_state when CONFIG_PM is unset
(Kai-Heng Feng)
- Correct spelling mistake in a comment in the hibernation code (Wang
Honghui)
- Add arch_resume_nosmt() prototype to avoid a "missing prototypes"
build warning (Arnd Bergmann)
- Restrict pm_pr_dbg() to system-wide power transitions and use it in
a few additional places (Mario Limonciello)
- Drop verification of in-params from genpd_add_device() and ensure
that all of its callers will do it (Ulf Hansson)
- Prevent possible integer overflows from occurring in
genpd_parse_state() (Nikita Zhandarovich)
- Reorder fieldls in 'struct devfreq_dev_status' to reduce its size
somewhat (Christophe JAILLET)
- Ensure that the Exynos PPMU driver is already loaded before the
Exynos Bus driver starts probing so as to avoid a possible freeze
loading of the kernel modules (Marek Szyprowski)
- Fix variable deferencing before NULL check in the mtk-cci devfreq
driver (Sukrut Bellary)"
* tag 'pm-6.5-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: (42 commits)
intel_idle: Add a "Long HLT" C1 state for the VM guest mode
cpufreq: intel_pstate: Fix energy_performance_preference for passive
cpufreq: amd-pstate: Add a kernel config option to set default mode
cpufreq: amd-pstate: Set a fallback policy based on preferred_profile
ACPI: CPPC: Add definition for undefined FADT preferred PM profile value
cpufreq: amd-pstate: Set default governor to schedutil
PM: domains: Move the verification of in-params from genpd_add_device()
cpufreq: amd-pstate: Make amd-pstate EPP driver name hyphenated
cpufreq: amd-pstate: Write CPPC enable bit per-socket
intel_idle: Add support for using intel_idle in a VM guest using just hlt
cpufreq: Fail driver register if it has adjust_perf without fast_switch
intel_idle: clean up the (new) state_update_enter_method function
intel_idle: refactor state->enter manipulation into its own function
platform/x86/amd: pmc: Use pm_pr_dbg() for suspend related messages
pinctrl: amd: Use pm_pr_dbg to show debugging messages
ACPI: x86: Add pm_debug_messages for LPS0 _DSM state tracking
include/linux/suspend.h: Only show pm_pr_dbg messages at suspend/resume
powercap: RAPL: Fix a NULL vs IS_ERR() bug
powercap: RAPL: Fix CONFIG_IOSF_MBI dependency
powercap: RAPL: fix invalid initialization for pl4_supported field
...
Dybcio)
- Add DT bindings and support for QCom MSM8226 (Matti Lehtimäki)
- Add DT bindings for QCom ipq9574 (Praveenkumar I)
- Convert bcm2835 DT bindings to the yaml schema (Stefan Wahren)
- Allow selecting the bang-bang governor as default (Thierry Reding)
- Refactor and prepare the code to set the scene for RCar Gen4
(Wolfram Sang)
- Cleanup and fixes for the QCom tsens drivers. Add DT bindings and
calibration for the MSM8909 platform (Stephan Gerhold)
- Revert a patch introducing a wrong usage of devm_of_iomap() on the
Mediatek platform (Ricardo Cañuelo)
- Fix the clock vs reset ordering in order to conform to the
documentation on the sun8i (Christophe JAILLET)
- Prevent setting up undocumented registers, enable the only described
sensors and add the version 2.1 on the Qoriq sensor (Peng Fan)
- Add DT bindings and support for the Armada AP807 (Alex Leibovich)
- Update the mlx5 driver with the recent thermal changes (Daniel
Lezcano)
- Convert to platform remove callback returning void on STM32 (Uwe
Kleine-König)
- Add an error information printing for devm_thermal_add_hwmon_sysfs()
and remove the error from the Sun8i, Amlogic, i.MX, TI, K3, Tegra,
Qoriq, Mediateka and QCom (Yangtao Li)
- Register as hwmon sensor for the Generic ADC (Chen-Yu Tsai)
- Use the dev_err_probe() function in the QCom tsens alarm driver
(Luca Weiss)
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Merge tag 'thermal-v6.5-rc1' of ssh://gitolite.kernel.org/pub/scm/linux/kernel/git/thermal/linux into thermal
Pull thermal control updates for 6.5-rc1 from Daniel Lezcano:
"- Add DT bindings for SM6375, MSM8226 and QCM2290 Qcom platforms (Konrad
Dybcio)
- Add DT bindings and support for QCom MSM8226 (Matti Lehtimäki)
- Add DT bindings for QCom ipq9574 (Praveenkumar I)
- Convert bcm2835 DT bindings to the yaml schema (Stefan Wahren)
- Allow selecting the bang-bang governor as default (Thierry Reding)
- Refactor and prepare the code to set the scene for RCar Gen4
(Wolfram Sang)
- Cleanup and fixes for the QCom tsens drivers. Add DT bindings and
calibration for the MSM8909 platform (Stephan Gerhold)
- Revert a patch introducing a wrong usage of devm_of_iomap() on the
Mediatek platform (Ricardo Cañuelo)
- Fix the clock vs reset ordering in order to conform to the
documentation on the sun8i (Christophe JAILLET)
- Prevent setting up undocumented registers, enable the only described
sensors and add the version 2.1 on the Qoriq sensor (Peng Fan)
- Add DT bindings and support for the Armada AP807 (Alex Leibovich)
- Update the mlx5 driver with the recent thermal changes (Daniel
Lezcano)
- Convert to platform remove callback returning void on STM32 (Uwe
Kleine-König)
- Add an error information printing for devm_thermal_add_hwmon_sysfs()
and remove the error from the Sun8i, Amlogic, i.MX, TI, K3, Tegra,
Qoriq, Mediateka and QCom (Yangtao Li)
- Register as hwmon sensor for the Generic ADC (Chen-Yu Tsai)
- Use the dev_err_probe() function in the QCom tsens alarm driver
(Luca Weiss)"
* tag 'thermal-v6.5-rc1' of ssh://gitolite.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (38 commits)
thermal/drivers/qcom/temp-alarm: Use dev_err_probe
thermal/drivers/generic-adc: Register thermal zones as hwmon sensors
thermal/drivers/mediatek/lvts_thermal: Remove redundant msg in lvts_ctrl_start()
thermal/drivers/qcom: Remove redundant msg at probe time
thermal/drivers/ti-soc: Remove redundant msg in ti_thermal_expose_sensor()
thermal/drivers/qoriq: Remove redundant msg in qoriq_tmu_register_tmu_zone()
thermal/drivers/tegra: Remove redundant msg in tegra_tsensor_register_channel()
drivers/thermal/k3: Remove redundant msg in k3_bandgap_probe()
thermal/drivers/imx: Remove redundant msg in imx8mm_tmu_probe() and imx_sc_thermal_probe()
thermal/drivers/amlogic: Remove redundant msg in amlogic_thermal_probe()
thermal/drivers/sun8i: Remove redundant msg in sun8i_ths_register()
thermal/hwmon: Add error information printing for devm_thermal_add_hwmon_sysfs()
thermal/drivers/stm32: Convert to platform remove callback returning void
net/mlx5: Update the driver with the recent thermal changes
thermal/drivers/armada: Add support for AP807 thermal data
dt-bindings: armada-thermal: Add armada-ap807-thermal compatible
thermal/drivers/qoriq: Support version 2.1
thermal/drivers/qoriq: Only enable supported sensors
thermal/drivers/qoriq: No need to program site adjustment register
thermal/drivers/mediatek/lvts_thermal: Register thermal zones as hwmon sensors
...
Merge power capping updates for 6.5-rc1:
- Introduce power capping core support for Intel TPMI (Topology Aware
Register and PM Capsule Interface) and a TPMI interface driver for
Intel RAPL (Zhang Rui, Dan Carpenter).
- Fix CONFIG_IOSF_MBI dependency in the Intel RAPL power capping
driver (Zhang Rui).
- Fix invalid initialization for pl4_supported field in the Intel RAPL
power capping driver (Sumeet Pawnikar).
* powercap:
powercap: RAPL: Fix a NULL vs IS_ERR() bug
powercap: RAPL: Fix CONFIG_IOSF_MBI dependency
powercap: RAPL: fix invalid initialization for pl4_supported field
powercap: intel_rapl: Introduce RAPL TPMI interface driver
powercap: intel_rapl: Introduce core support for TPMI interface
powercap: intel_rapl: Introduce RAPL I/F type
powercap: intel_rapl: Make cpu optional for rapl_package
powercap: intel_rapl: Remove redundant cpu parameter
powercap: intel_rapl: Add support for lock bit per Power Limit
powercap: intel_rapl: Cleanup Power Limits support
powercap: intel_rapl: Use bitmap for Power Limits
powercap: intel_rapl: Change primitive order
powercap: intel_rapl: Use index to initialize primitive information
powercap: intel_rapl: Support per domain energy/power/time unit
powercap: intel_rapl: Support per Interface primitive information
powercap: intel_rapl: Support per Interface rapl_defaults
powercap: intel_rapl: Allow probing without CPUID match
powercap: intel_rapl: Remove unused field in struct rapl_if_priv
Use the dev_err_probe function instead of dev_err in the probe function
so that the printed message includes the return value and also handles
-EPROBE_DEFER nicely.
Signed-off-by: Luca Weiss <luca@z3ntu.xyz>
Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230625-spmi-temp-alarm-defer-v1-1-2d57acf36855@z3ntu.xyz
Register thermal zones as hwmon sensors to let userspace read
temperatures using standard hwmon interface.
Signed-off-by: Chen-Yu Tsai <wenst@chromium.org>
[Yangtao: only keep devm_thermal_add_hwmon_sysfs]
Signed-off-by: Yangtao Li <frank.li@vivo.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230620090732.50025-11-frank.li@vivo.com
The upper-layer devm_thermal_add_hwmon_sysfs() function can directly
print error information.
Signed-off-by: Yangtao Li <frank.li@vivo.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230620090732.50025-10-frank.li@vivo.com
The upper-layer devm_thermal_add_hwmon_sysfs() function can directly
print error information.
Signed-off-by: Yangtao Li <frank.li@vivo.com>
Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230620090732.50025-9-frank.li@vivo.com
The upper-layer devm_thermal_add_hwmon_sysfs() function can directly
print error information.
Signed-off-by: Yangtao Li <frank.li@vivo.com>
Acked-by: Keerthy <j-keerthy@ti.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230620090732.50025-8-frank.li@vivo.com
The upper-layer devm_thermal_add_hwmon_sysfs() function can directly
print error information.
Signed-off-by: Yangtao Li <frank.li@vivo.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230620090732.50025-7-frank.li@vivo.com
The upper-layer devm_thermal_add_hwmon_sysfs() function can directly
print error information.
Signed-off-by: Yangtao Li <frank.li@vivo.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230620090732.50025-6-frank.li@vivo.com
The upper-layer devm_thermal_add_hwmon_sysfs() function can directly
print error information.
Signed-off-by: Yangtao Li <frank.li@vivo.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230620090732.50025-5-frank.li@vivo.com
The upper-layer devm_thermal_add_hwmon_sysfs() function can directly
print error information.
Signed-off-by: Yangtao Li <frank.li@vivo.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230620090732.50025-4-frank.li@vivo.com
The upper-layer devm_thermal_add_hwmon_sysfs() function can directly
print error information.
Signed-off-by: Yangtao Li <frank.li@vivo.com>
Reviewed-by: Martin Blumenstingl <martin.blumenstingl@googlemail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230620090732.50025-3-frank.li@vivo.com
The upper-layer devm_thermal_add_hwmon_sysfs() function can directly
print error information.
Signed-off-by: Yangtao Li <frank.li@vivo.com>
Acked-by: Jernej Skrabec <jernej.skrabec@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230620090732.50025-2-frank.li@vivo.com
Ensure that all error handling branches print error information. In this
way, when this function fails, the upper-layer functions can directly
return an error code without missing debugging information. Otherwise,
the error message will be printed redundantly or missing.
Signed-off-by: Yangtao Li <frank.li@vivo.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230620090732.50025-1-frank.li@vivo.com
The .remove() callback for a platform driver returns an int which makes
many driver authors wrongly assume it's possible to do error handling by
returning an error code. However the value returned is (mostly) ignored
and this typically results in resource leaks. To improve here there is a
quest to make the remove callback return void. In the first step of this
quest all drivers are converted to .remove_new() which already returns
void.
st_thermal_unregister() always returned zero, so convert it to return void
without any loss and then just drop the return from st_mmap_remove().
Signed-off-by: Uwe Kleine-König <u.kleine-koenig@pengutronix.de>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230616165641.1055854-1-u.kleine-koenig@pengutronix.de
Add support for the AP807 die thermal data. This is the same as AP806,
except for the coefficients.
ap807 values taken from TSENSE_ADC_16FFC spec, which says:
T(in Celsius) = T(code)*TSENE_GAIN+TSENE_OFFSET
where in default:
TSENE_OFFSET = 128.9
TSENE_GAIN = 0.394
Signed-off-by: Alex Leibovich <alexl@marvell.com>
Tested-by: sa_ip-sw-jenkins <sa_ip-sw-jenkins@marvell.com>
Reviewed-by: Stefan Chulski <stefanc@marvell.com>
Signed-off-by: Russell King (Oracle) <rmk+kernel@armlinux.org.uk>
Reviewed-by: Miquel Raynal <miquel.raynal@bootlin.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/E1qA7yU-00Ea4u-Je@rmk-PC.armlinux.org.uk
i.MX93 use TMU version 2.1, which supports:
- TRITSR_TP5(When this field is 1, you must add 0.5 K to the temperature
that TEMP reports. For example, if TEMP is 300 K and TP5=1, then the
final temperature is 300.5 K.)
- Has 16 TTRCR register: Temperature Range Control (TTRCR0 - TTRCR15)
This patch is to add this support.
Signed-off-by: Peng Fan <peng.fan@nxp.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230516083746.63436-4-peng.fan@oss.nxp.com
There are MAX 16 sensors, but not all of them supported. Such as
i.MX8MQ, there are only 3 sensors. Enabling all 16 sensors will
touch reserved bits from i.MX8MQ reference mannual, and TMU will stuck,
temperature will not update anymore.
Fixes: 45038e03d6 ("thermal: qoriq: Enable all sensors before registering them")
Signed-off-by: Peng Fan <peng.fan@nxp.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230516083746.63436-3-peng.fan@oss.nxp.com
No need to program site adjustment register, as programming
these registers do not give accurate value and also these
registers are not mentioned in Reference Manual.
Signed-off-by: Pankit Garg <pankit.garg@nxp.com>
Signed-off-by: Peng Fan <peng.fan@nxp.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230516083746.63436-2-peng.fan@oss.nxp.com
Register thermal zones as hwmon sensors to let userspace read
temperatures using standard hwmon interface.
Signed-off-by: Chen-Yu Tsai <wenst@chromium.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230613091317.1691247-1-wenst@chromium.org
Should an error occur after calling sun8i_ths_resource_init() in the probe
function, some resources need to be released, as already done in the
.remove() function.
Switch to the devm_clk_get_enabled() helper and add a new devm_action to
turn sun8i_ths_resource_init() into a fully managed function.
Move the place where reset_control_deassert() is called so that the
recommended order of reset release/clock enable steps is kept.
A64 manual states that:
3.3.6.4. Gating and reset
Make sure that the reset signal has been released before the release of
module clock gating;
This fixes the issue and removes some LoC at the same time.
Fixes: dccc5c3b6f ("thermal/drivers/sun8i: Add thermal driver for H6/H5/H3/A64/A83T/R40")
Signed-off-by: Christophe JAILLET <christophe.jaillet@wanadoo.fr>
Acked-by: Maxime Ripard <maxime@cerno.tech>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/a8ae84bd2dc4b55fe428f8e20f31438bf8bb6762.1684089931.git.christophe.jaillet@wanadoo.fr
This reverts commit f05c7b7d9e.
That change was causing a regression in the generic-adc-thermal-probed
bootrr test as reported in the kernelci-results list [1].
A proper rework will take longer, so revert it for now.
[1] https://groups.io/g/kernelci-results/message/42660
Fixes: f05c7b7d9e ("thermal/drivers/mediatek: Use devm_of_iomap to avoid resource leak in mtk_thermal_probe")
Signed-off-by: Ricardo Cañuelo <ricardo.canuelo@collabora.com>
Suggested-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230525121811.3360268-1-ricardo.canuelo@collabora.com
According to the msm-3.18 vendor kernel from Qualcomm, mdm9607 needs
"correction factors" to adjust for additional offsets observed after the
factory calibration values in the fuses [1, 2].
The fixed offsets should be applied unless there is a special
calibration mode value that indicates that no offsets are needed [3].
Note that the new calibration mode values are called differently in this
patch compared to the vendor kernel:
- TSENS_TWO_POINT_CALIB_N_WA -> ONE_PT_CALIB2_NO_OFFSET
- TSENS_TWO_POINT_CALIB_N_OFFSET_WA -> TWO_PT_CALIB_NO_OFFSET
This is because close inspection of the calibration function [3] reveals
that TSENS_TWO_POINT_CALIB_N_WA is actually a "one point" calibration
because the if statements skip all "point2" related code for it.
[1]: d9d2db1b82
[2]: d75aef53a7
[3]: https://git.codelinaro.org/clo/la/kernel/msm-3.18/-/blob/LE.UM.4.3.2.r1-04200-9x07/drivers/thermal/msm-tsens.c#L2987-3136
Fixes: a2149ab815 ("thermal/drivers/qcom/tsens-v0_1: Add support for MDM9607")
Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Signed-off-by: Stephan Gerhold <stephan.gerhold@kernkonzept.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230508-msm8909-tsens-v5-3-5eb632235ba7@kernkonzept.com
The old single-cell parsing code was removed for MSM8939, MDM9607 and
MSM8976 but for some reason the structs defining the bit positions etc
were kept around (unused). Drop them now.
Cc: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Fixes: 51d78b8b1b ("thermal/drivers/tsens: Drop single-cell code for mdm9607")
Fixes: dfadb4599a ("thermal/drivers/tsens: Drop single-cell code for msm8939")
Fixes: 3a908971f7 ("thermal/drivers/tsens: Drop single-cell code for msm8976/msm8956")
Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Signed-off-by: Stephan Gerhold <stephan.gerhold@kernkonzept.com>
Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230508-msm8909-tsens-v5-1-5eb632235ba7@kernkonzept.com
For many setups the bang-bang governor is exactly what we want. Many
ARM SoC-based devices use fans to cool down the entire SoC and that
works well only with the bang-bang governor because it uses the
hysteresis in order to let the fan run for a while to cool the SoC
down below the trip point before switching it off again.
The step-wise governor will behave strangely in these situations. It
doesn't use the hysteresis, so it can lead to situations where the fan
is turned on for only a very brief period and then is switched back off,
only to get switched back on again very quickly because the SoC hasn't
cooled down very much.
Signed-off-by: Thierry Reding <treding@nvidia.com>
Link: https://lore.kernel.org/r/20230609124408.3788680-1-thierry.reding@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
The MSM8226 TSENS IP has 6 thermal sensors in a TSENS v0.1 block.
The thermal sensors use non-standard slope values.
Signed-off-by: Matti Lehtimäki <matti.lehtimaki@gmail.com>
Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Reviewed-by: Luca Weiss <luca@z3ntu.xyz>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230507201225.89694-4-matti.lehtimaki@gmail.com
The registers are differently named and at different offsets, but their
functionality is the same as for Gen3.
Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Tested-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230511192220.7523-4-wsa+renesas@sang-engineering.com
Gen4 will be very different, so refactor Gen3 access into separate call
first.
Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Tested-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230511192220.7523-3-wsa+renesas@sang-engineering.com
More items to describe the TSCs are needed soon, so encapsulate the
current 'ths_tj_1' item into a struct.
Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Tested-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230511192220.7523-2-wsa+renesas@sang-engineering.com
Since commit 955fb8719e ("thermal/intel/intel_soc_dts_iosf: Use Intel
TCC library") intel_soc_dts_iosf is reporting the wrong temperature.
The driver expects tj_max to be in milli-degrees-celcius but after
the switch to the TCC library this is now in degrees celcius so
instead of e.g. 90000 it is set to 90 causing a temperature 45
degrees below tj_max to be reported as -44910 milli-degrees
instead of as 45000 milli-degrees.
Fix this by adding back the lost factor of 1000.
Fixes: 955fb8719e ("thermal/intel/intel_soc_dts_iosf: Use Intel TCC library")
Reported-by: Bernhard Krug <b.krug@elektronenpumpe.de>
Signed-off-by: Hans de Goede <hdegoede@redhat.com>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Cc: 6.3+ <stable@vger.kernel.org> # 6.3+
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Export Passive version 2 table similar to the way _TRT and _ART tables
via IOCTLs.
This removes need for binary utility to read ACPI Passive 2 table by
providing open source support. This table already has open source
implementation in the user space thermald, when the table is part of
data vault exported by the int3400 sysfs.
This table is supported in some older platforms before Ice Lake
generation.
Passive 2 tables contain multiple entries. Each entry has following
fields:
* Source: Named Reference (String). This is the source device for
temperature.
* Target: Named Reference (String). This is the target device to
control.
* Priority: Priority of this device compared to others.
* SamplingPeriod: Time Period in 1/10 of seconds unit.
* PassiveTemp: Passive Temperature in 1/10 of Kelvin.
* SourceDomain: Domain for the source (00:Processor, others reserved).
* ControlKnob: Type of control knob (00:Power Limit 1, others: reserved)
* Limit: The target state to set on reaching passive temperature.
This can be a string "max", "min" or a power limit value.
* LimitStepSize: Step size during activation.
* UnLimitStepSize: Step size during deactivation.
* Reserved1: Reserved
Three IOCTLs are added similar to IOCTLs for reading TRT:
ACPI_THERMAL_GET_PSVT_COUNT: Number of passive 2 entries.
ACPI_THERMAL_GET_PSVT_LEN: Total return data size (count x each
passive 2 entry size).
ACPI_THERMAL_GET_PSVT: Get the data as an array of objects with
passive 2 entries.
This change is based on original development done by:
Todd Brandt <todd.e.brandt@linux.intel.com>
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
[ rjw: Changelog and subject edits ]
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Prior to the commit "763bd29fd3d1 ("thermal: int340x_thermal: Use
sysfs_emit_at() instead of scnprintf()", there was a new line after each
UUID string.
With the newline removed, existing user space like "thermald" fails to
compare each supported UUID as it is using getline() to read UUID and
apply correct thermal table.
To avoid breaking existing user space, add newline after each UUID string.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Fixes: 763bd29fd3 ("thermal: int340x_thermal: Use sysfs_emit_at() instead of scnprintf()")
Cc: 6.3+ <stable@vger.kernel.org> # 6.3+
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Different RAPL Interfaces may have different primitive information and
rapl_defaults calls.
To better distinguish this difference in the RAPL framework code,
introduce a new enum to represent different types of RAPL Interfaces.
No functional change.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Tested-by: Wang Wendy <wendy.wang@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
MSR RAPL Interface always removes a rapl_package when all the CPUs in
that rapl_package are offlined. This is because it relies on an online
CPU to access the MSR.
But for RAPL Interface using MMIO registers, when all the cpus within
the rapl_package are offlined,
1. the register can still be accessed
2. monitoring and setting the Power Pimits for the rapl_package is still
meaningful because of uncore power.
This means that, a valid rapl_package doesn't rely on one or more cpus
being onlined.
For this sense, make cpu optional for rapl_package. A rapl_package can
be registered either using a CPU id to represent the physical
package/die, or using the physical package id directly.
Note that, the thermal throttling interrupt is not disabled via
MSR_IA32_PACKAGE_THERM_INTERRUPT for such rapl_package at the moment.
If it is still needed in the future, this can be achieved by selecting
an onlined CPU using the physical package id.
Note that, processor_thermal_rapl, the current MMIO RAPL Interface
driver, can also be converted to register using a package id instead.
But this is not done right now because processor_thermal_rapl driver
works on single-package systems only, and offlining the only package
will not happen. So keep the previous logic.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Tested-by: Wang Wendy <wendy.wang@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Currently, a RAPL package is registered with the number of Power Limits
supported in each RAPL domain. But this doesn't tell which Power Limits
are available. Using the number of Power Limits supported to guess the
availability of each Power Limit is fragile.
Use bitmap to represent the availability of each Power Limit.
Note that PL1 is mandatory thus it does not need to be set explicitly by
the RAPL Interface drivers.
No functional change intended.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Tested-by: Wang Wendy <wendy.wang@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
If cur_state for the powerclamp cooling device is set to the default
minimum state of 0, without setting first to cur_state > 0, this results
in NULL pointer access.
This NULL pointer access happens in the powercap core idle-inject
function idle_inject_set_duration() as there is no NULL check for
idle_inject_device pointer. This pointer must be allocated by calling
idle_inject_register() or idle_inject_register_full().
In the function powerclamp_set_cur_state(), idle_inject_device pointer
is allocated only when the cur_state > 0. But setting 0 without changing
to any other state, idle_inject_set_duration() will be called with a
NULL idle_inject_device pointer.
To address this, just return from powerclamp_set_cur_state() if the
current cooling device state is the same as the last one. Since the
power-up default cooling device state is 0, changing the state to 0
again here will return without calling idle_inject_set_duration().
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Fixes: 8526eb7fc7 ("thermal: intel: powerclamp: Use powercap idle-inject feature")
Bugzilla: https://bugzilla.kernel.org/show_bug.cgi?id=217386
Tested-by: Risto A. Paju <teknohog@iki.fi>
Cc: 6.3+ <stable@kernel.org> # 6.3+
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
- Add compatible DT bindings for imx6sll and imx6ul to fix a dtbs check
warning (Stefan Wahren).
- Update the example in the DT bindings to reflect changes with the
ADC node name for QCom TM and TM5 (Marijn Suijten).
- Fix comments for the cpuidle_cooling_register() function to match the
function prototype (Chenggang Wang).
- Fix inconsistent temperature read and some Mediatek variant board
reboot by reverting a change and handling the temperature
differently (AngeloGioacchino Del Regno).
- Fix a memory leak in the initialization error path for the Mediatek
driver (Kang Chen).
- Use of_address_to_resource() in the Mediatek driver (Rob Herring).
- Fix unit address in the QCom tsens driver DT bindings (Krzysztof
Kozlowski).
- Clean up the step-wise thermal governor (Zhang Rui).
- Introduce thermal_zone_device() for accessing the device field of
struct thermal_zone_device and two drivers use it (Daniel Lezcano).
- Clean up the ACPI thermal driver a bit (Daniel Lezcano).
- Delete the thermal driver for Intel Menlow platforms that is not
expected to have any users (Rafael Wysocki).
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Merge tag 'thermal-6.4-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm
Pull more thermal control updates from Rafael Wysocki:
"These are mostly cleanups on top of the previously merged thermal
control changes plus some driver fixes and the removal of the Intel
Menlow thermal driver.
Specifics:
- Add compatible DT bindings for imx6sll and imx6ul to fix a dtbs
check warning (Stefan Wahren)
- Update the example in the DT bindings to reflect changes with the
ADC node name for QCom TM and TM5 (Marijn Suijten)
- Fix comments for the cpuidle_cooling_register() function to match
the function prototype (Chenggang Wang)
- Fix inconsistent temperature read and some Mediatek variant board
reboot by reverting a change and handling the temperature
differently (AngeloGioacchino Del Regno)
- Fix a memory leak in the initialization error path for the Mediatek
driver (Kang Chen)
- Use of_address_to_resource() in the Mediatek driver (Rob Herring)
- Fix unit address in the QCom tsens driver DT bindings (Krzysztof
Kozlowski)
- Clean up the step-wise thermal governor (Zhang Rui)
- Introduce thermal_zone_device() for accessing the device field of
struct thermal_zone_device and two drivers use it (Daniel Lezcano)
- Clean up the ACPI thermal driver a bit (Daniel Lezcano)
- Delete the thermal driver for Intel Menlow platforms that is not
expected to have any users (Rafael Wysocki)"
* tag 'thermal-6.4-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm:
thermal: intel: menlow: Get rid of this driver
ACPI: thermal: Move to dedicated function sysfs extra attr creation
ACPI: thermal: Use thermal_zone_device()
thermal: intel: pch_thermal: Use thermal driver device to write a trace
thermal: core: Encapsulate tz->device field
thermal: gov_step_wise: Adjust code logic to match comment
thermal: gov_step_wise: Delete obsolete comment
dt-bindings: thermal: qcom-tsens: Correct unit address
thermal/drivers/mediatek: Use of_address_to_resource()
thermal/drivers/mediatek: Change clk_prepare_enable to devm_clk_get_enabled in mtk_thermal_probe
thermal/drivers/mediatek: Use devm_of_iomap to avoid resource leak in mtk_thermal_probe
thermal/drivers/mediatek: Add temperature constraints to validate read
Revert "thermal/drivers/mediatek: Add delay after thermal banks initialization"
thermal/drivers/cpuidle_cooling: Delete unmatched comments
dt-bindings: thermal: Use generic ADC node name in examples
dt-bindings: imx-thermal: Add imx6sll and imx6ul compatible
Merge additional thermal core and ACPI thermal changes for 6.4-rc1:
- Clean up the step-wise thermal governor (Zhang Rui).
- Introduce thermal_zone_device() for accessing the device field of
struct thermal_zone_device and two drivers use it (Daniel Lezcano).
- Clean up the ACPI thermal driver a bit (Daniel Lezcano).
- Delete the thermal driver for Intel Menlow platforms that is not
expected to have any users (Rafael Wysocki).
* thermal-core:
thermal: intel: menlow: Get rid of this driver
ACPI: thermal: Move to dedicated function sysfs extra attr creation
ACPI: thermal: Use thermal_zone_device()
thermal: intel: pch_thermal: Use thermal driver device to write a trace
thermal: core: Encapsulate tz->device field
thermal: gov_step_wise: Adjust code logic to match comment
thermal: gov_step_wise: Delete obsolete comment
According to my information, there are no active users of this driver in
the field.
Moreover, it does some really questionable things and gets in the way of
thermal core improvements, so drop it.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
The pch_critical() callback accesses the thermal zone device structure
internals, it dereferences the thermal zone struct device and the 'type'.
Use the available accessors instead of accessing the structure directly.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
There are still some drivers needing to play with the thermal zone
device internals. That is not the best but until we can figure out if
the information is really needed, let's encapsulate the field used in
the thermal zone device structure, so we can move forward relocating
the thermal zone device structure definition in the thermal framework
private headers.
Some drivers are accessing tz->device, that implies they need to have
the knowledge of the thermal_zone_device structure but we want to
self-encapsulate this structure and reduce the scope of the structure
to the thermal core only.
By adding this wrapper, these drivers won't need the thermal zone
device structure definition and are no longer an obstacle to its
relocation to the private thermal core headers.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
For the algorithm of choosing the next target state in step_wise
governor, the code does the right thing but is implemented in a
way different from what the comment describes. And this hurts the code
readability.
As the logic in the comment is simpler, adjust the code logic to align
with the comment.
No functional change.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
[ rjw: Subject edit ]
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Commit 4102c4042a ("thermal/core: Remove DROP_FULL and RAISE_FULL")
removes support for THERMAL_TREND_RAISE_FULL/DROP_FULL but leaves the
comment unchanged.
Delete the obsolte comment about THERMAL_TREND_RAISE_FULL/DROP_FULL.
Fixes: 4102c4042a ("thermal/core: Remove DROP_FULL and RAISE_FULL")
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
- First part of DT header detangling dropping cpu.h from of_device.h
and replacing some includes with forward declarations. A handful of
drivers needed some adjustment to their includes as a result.
- Refactor of_device.h to be used by bus drivers rather than various
device drivers. This moves non-bus related functions out of
of_device.h. The end goal is for of_platform.h and of_device.h to stop
including each other.
- Refactor open coded parsing of "ranges" in some bus drivers to use DT
address parsing functions
- Add some new address parsing functions of_property_read_reg(),
of_range_count(), and of_range_to_resource() in preparation to convert
more open coded parsing of DT addresses to use them.
- Treewide clean-ups to use of_property_read_bool() and
of_property_present() as appropriate. The ones here are the ones
that didn't get picked up elsewhere.
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Merge tag 'devicetree-for-6.4-2' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux
Pull more devicetree updates from Rob Herring:
- First part of DT header detangling dropping cpu.h from of_device.h
and replacing some includes with forward declarations. A handful of
drivers needed some adjustment to their includes as a result.
- Refactor of_device.h to be used by bus drivers rather than various
device drivers. This moves non-bus related functions out of
of_device.h. The end goal is for of_platform.h and of_device.h to
stop including each other.
- Refactor open coded parsing of "ranges" in some bus drivers to use DT
address parsing functions
- Add some new address parsing functions of_property_read_reg(),
of_range_count(), and of_range_to_resource() in preparation to
convert more open coded parsing of DT addresses to use them.
- Treewide clean-ups to use of_property_read_bool() and
of_property_present() as appropriate. The ones here are the ones that
didn't get picked up elsewhere.
* tag 'devicetree-for-6.4-2' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (34 commits)
bus: tegra-gmi: Replace of_platform.h with explicit includes
hte: Use of_property_present() for testing DT property presence
w1: w1-gpio: Use of_property_read_bool() for boolean properties
virt: fsl: Use of_property_present() for testing DT property presence
soc: fsl: Use of_property_present() for testing DT property presence
sbus: display7seg: Use of_property_read_bool() for boolean properties
sparc: Use of_property_read_bool() for boolean properties
sparc: Use of_property_present() for testing DT property presence
bus: mvebu-mbus: Remove open coded "ranges" parsing
of/address: Add of_property_read_reg() helper
of/address: Add of_range_count() helper
of/address: Add support for 3 address cell bus
of/address: Add of_range_to_resource() helper
of: unittest: Add bus address range parsing tests
of: Drop cpu.h include from of_device.h
OPP: Adjust includes to remove of_device.h
irqchip: loongson-eiointc: Add explicit include for cpuhotplug.h
cpuidle: Adjust includes to remove of_device.h
cpufreq: sun50i: Add explicit include for cpu.h
cpufreq: Adjust includes to remove of_device.h
...
Replace of_get_address() and of_translate_address() calls with single
call to of_address_to_resource().
Signed-off-by: Rob Herring <robh@kernel.org>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230319163231.226738-1-robh@kernel.org
Use devm_clk_get_enabled to do automatic resource management.
Meanwhile, remove error handling labels in the probe function and
the whole remove function.
Signed-off-by: Kang Chen <void0red@hust.edu.cn>
Reviewed-by: Dongliang Mu <dzm91@hust.edu.cn>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230419020749.621257-2-void0red@hust.edu.cn
Smatch reports:
1. mtk_thermal_probe() warn: 'apmixed_base' from of_iomap() not released.
2. mtk_thermal_probe() warn: 'auxadc_base' from of_iomap() not released.
The original code forgets to release iomap resource when handling errors,
fix it by switch to devm_of_iomap.
Fixes: 89945047b1 ("thermal: mediatek: Add tsensor support for V2 thermal system")
Signed-off-by: Kang Chen <void0red@hust.edu.cn>
Reviewed-by: Dongliang Mu <dzm91@hust.edu.cn>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230419020749.621257-1-void0red@hust.edu.cn
The AUXADC thermal v1 allows reading temperature range between -20°C to
150°C and any value out of this range is invalid.
Add new definitions for MT8173_TEMP_{MIN_MAX} and a new small helper
mtk_thermal_temp_is_valid() to check if new readings are in range: if
not, we tell to the API that the reading is invalid by returning
THERMAL_TEMP_INVALID.
It was chosen to introduce the helper function because, even though this
temperature range is realistically ok for all, it comes from a downstream
kernel driver for version 1, but here we also support v2 and v3 which may
may have wider constraints.
Signed-off-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230419061146.22246-3-angelogioacchino.delregno@collabora.com
Some more testing revealed that this commit introduces a regression on some
MT8173 Chromebooks and at least on one MT6795 Sony Xperia M5 smartphone due
to the delay being apparently variable and machine specific.
Another solution would be to delay for a bit more (~70ms) but this is not
feasible for two reasons: first of all, we're adding an even bigger delay
in a probe function; second, some machines need less, some may need even
more, making the msleep at probe solution highly suboptimal.
This reverts commit 10debf8c2d.
Fixes: 10debf8c2d ("thermal/drivers/mediatek: Add delay after thermal banks initialization")
Reported-by: "kernelci.org bot" <bot@kernelci.org>
Signed-off-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230419061146.22246-2-angelogioacchino.delregno@collabora.com
Add support for DLVR (Digital Linear Voltage Regulator) attributes,
which can be used to control RFIM.
Here instead of "fivr" another directory "dlvr" is created with DLVR
attributes:
/sys/bus/pci/devices/0000:00:04.0/dlvr
├── dlvr_freq_mhz
├── dlvr_freq_select
├── dlvr_hardware_rev
├── dlvr_pll_busy
├── dlvr_rfim_enable
└── dlvr_spread_spectrum_pct
└── dlvr_control_mode
└── dlvr_control_lock
Attributes
dlvr_freq_mhz (RO):
Current DLVR PLL frequency in MHz.
dlvr_freq_select (RW):
Sets DLVR PLL clock frequency.
dlvr_hardware_rev (RO):
DLVR hardware revision.
dlvr_pll_busy (RO):
PLL can't accept frequency change when set.
dlvr_rfim_enable (RW):
0: Disable RF frequency hopping, 1: Enable RF frequency hopping.
dlvr_control_mode (RW):
Specifies how frequencies are spread. 0: Down spread, 1: Spread in Center.
dlvr_control_lock (RW):
1: future writes are ignored.
dlvr_spread_spectrum_pct (RW)
A write to this register updates the DLVR spread spectrum percent value.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
[ rjw: Subject edits ]
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
(Sebastian Reichel)
- Add driver support for RK3588 (Finley Xiao)
- Use devm_reset_control_array_get_exclusive() for the Rockchip driver
(Ye Xingchen)
- Detect power gated thermal zones and return -EAGAIN when reading the
temperature (Mikko Perttunen)
- Remove thermal_bind_params structure as it is unused (Zhang Rui)
- Drop unneeded quotes in DT bindings allowing to run yamllint (Rob
Herring)
- Update the power allocator documentation according to the thermal
trace relocation (Lukas Bulwahn)
- Fix sensor 1 interrupt status bitmask for the Mediatek LVTS sensor
(Chen-Yu Tsai)
- Use the dev_err_probe() helper in the Amlogic driver (Ye Xingchen)
- Add AP domain support to LVTS thermal controllers for mt8195
(Balsam CHIHI)
- Remove buggy call to thermal_of_zone_unregister() (Daniel Lezcano)
- Make thermal_of_zone_[un]register() private to the thermal OF code
(Daniel Lezcano)
- Create a private copy of the thermal zone device parameters
structure when registering a thermal zone (Daniel Lezcano)
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Merge tag 'thermal-v6.4-rc1-2' of ssh://gitolite.kernel.org/pub/scm/linux/kernel/git/thermal/linux
Pull more thermal control changes for 6.4-rc1 from Daniel Lezcano:
"- Do preparating cleaning and DT bindings for RK3588 support
(Sebastian Reichel)
- Add driver support for RK3588 (Finley Xiao)
- Use devm_reset_control_array_get_exclusive() for the Rockchip driver
(Ye Xingchen)
- Detect power gated thermal zones and return -EAGAIN when reading the
temperature (Mikko Perttunen)
- Remove thermal_bind_params structure as it is unused (Zhang Rui)
- Drop unneeded quotes in DT bindings allowing to run yamllint (Rob
Herring)
- Update the power allocator documentation according to the thermal
trace relocation (Lukas Bulwahn)
- Fix sensor 1 interrupt status bitmask for the Mediatek LVTS sensor
(Chen-Yu Tsai)
- Use the dev_err_probe() helper in the Amlogic driver (Ye Xingchen)
- Add AP domain support to LVTS thermal controllers for mt8195
(Balsam CHIHI)
- Remove buggy call to thermal_of_zone_unregister() (Daniel Lezcano)
- Make thermal_of_zone_[un]register() private to the thermal OF code
(Daniel Lezcano)
- Create a private copy of the thermal zone device parameters
structure when registering a thermal zone (Daniel Lezcano)"
* tag 'thermal-v6.4-rc1-2' of ssh://gitolite.kernel.org/pub/scm/linux/kernel/git/thermal/linux:
thermal/core: Alloc-copy-free the thermal zone parameters structure
thermal/of: Unexport unused OF functions
thermal/drivers/bcm2835: Remove buggy call to thermal_of_zone_unregister
thermal/drivers/mediatek/lvts_thermal: Add AP domain for mt8195
dt-bindings: thermal: mediatek: Add AP domain to LVTS thermal controllers for mt8195
thermal: amlogic: Use dev_err_probe()
thermal/drivers/mediatek/lvts_thermal: Fix sensor 1 interrupt status bitmask
MAINTAINERS: adjust entry in THERMAL/POWER_ALLOCATOR after header movement
dt-bindings: thermal: Drop unneeded quotes
thermal/core: Remove thermal_bind_params structure
thermal/drivers/tegra-bpmp: Handle offline zones
thermal/drivers/rockchip: use devm_reset_control_array_get_exclusive()
dt-bindings: rockchip-thermal: Support the RK3588 SoC compatible
thermal/drivers/rockchip: Support RK3588 SoC in the thermal driver
thermal/drivers/rockchip: Support dynamic sized sensor array
thermal/drivers/rockchip: Simplify channel id logic
thermal/drivers/rockchip: Use dev_err_probe
thermal/drivers/rockchip: Simplify clock logic
thermal/drivers/rockchip: Simplify getting match data
Now that of_cpu_device_node_get() is defined in of.h, of_device.h is just
implicitly including other includes, and is no longer needed. Adjust the
include files with what was implicitly included by of_device.h (cpu.h and
of.h) and drop including of_device.h.
Acked-by: Rafael J. Wysocki <rafael@kernel.org>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230329-dt-cpu-header-cleanups-v1-12-581e2605fe47@kernel.org
Signed-off-by: Rob Herring <robh@kernel.org>
Some older processors don't allow BIT(13) and BIT(15) in the current
mask set by "THERM_STATUS_CLEAR_CORE_MASK". This results in:
unchecked MSR access error: WRMSR to 0x19c (tried to
write 0x000000000000aaa8) at rIP: 0xffffffff816f66a6
(throttle_active_work+0xa6/0x1d0)
To avoid unchecked MSR issues, check CPUID for each relevant feature and
use that information to set the supported feature bits only in the
"clear" mask for cores. Do the same for the analogous package mask set
by "THERM_STATUS_CLEAR_PKG_MASK".
Introduce functions thermal_intr_init_core_clear_mask() and
thermal_intr_init_pkg_clear_mask() to set core and package mask bits,
respectively. These functions are called during initialization.
Fixes: 6fe1e64b60 ("thermal: intel: Prevent accidental clearing of HFI status")
Reported-by: Rui Salvaterra <rsalvaterra@gmail.com>
Link: https://lore.kernel.org/lkml/cdf43fb423368ee3994124a9e8c9b4f8d00712c6.camel@linux.intel.com/T/
Tested-by: Rui Salvaterra <rsalvaterra@gmail.com>
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Cc: 6.2+ <stable@kernel.org> # 6.2+
[ rjw: Renamed 2 funtions and 2 static variables, edited subject and
changelog ]
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The caller of the function thermal_zone_device_register_with_trips()
can pass a thermal_zone_params structure parameter.
This one is used by the thermal core code until the thermal zone is
destroyed. That forces the caller, so the driver, to keep the pointer
valid until it unregisters the thermal zone if we want to make the
thermal zone device structure private the core code.
As the thermal zone device structure would be private, the driver can
not access to thermal zone device structure to retrieve the tzp field
after it passed it to register the thermal zone.
So instead of forcing the users of the function to deal with the tzp
structure life cycle, make the usage easier by allocating our own
thermal zone params, copying the parameter content and by freeing at
unregister time. The user can then create the parameters on the stack,
pass it to the registering function and forget about it.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230404075138.2914680-3-daniel.lezcano@linaro.org
The functions thermal_of_zone_register() and
thermal_of_zone_unregister() are no longer needed from the drivers as
the devm_ variant is always used.
Make them static in the C file and remove their declaration from thermal.h
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230404075138.2914680-2-daniel.lezcano@linaro.org
The driver is using the devm_thermal_of_zone_device_register().
In the error path of the function calling
devm_thermal_of_zone_device_register(), the function
devm_thermal_of_zone_unregister() should be called instead of
thermal_of_zone_unregister(), otherwise this one will be called twice
when the device is freed.
The same happens for the remove function where the devm_ guarantee the
thermal_of_zone_unregister() will be called, so adding this call in
the remove function will lead to a double free also.
Use devm_ variant in the error path of the probe function.
Remove thermal_of_zone_unregister() in the remove function.
Cc: Florian Fainelli <f.fainelli@gmail.com>
Cc: Ray Jui <rjui@broadcom.com>
Cc: Scott Branden <sbranden@broadcom.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230404075138.2914680-1-daniel.lezcano@linaro.org
Add MT8195 AP Domain support to LVTS Driver.
Take the opportunity to update the comments to show calibration data
information related to the new domain.
[dlezcano]: Massaged a bit the changelog
Signed-off-by: Balsam CHIHI <bchihi@baylibre.com>
Tested-by: Chen-Yu Tsai <wenst@chromium.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230307154524.118541-3-bchihi@baylibre.com
Replace the open-code with dev_err_probe() to simplify the code.
Signed-off-by: Ye Xingchen <ye.xingchen@zte.com.cn>
Reviewed-by: Neil Armstrong <neil.armstrong@linaro.org>
Reviewed-by: Martin Blumenstingl <martin.blumenstingl@googlemail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/202303241020110014476@zte.com.cn
The binary representation for sensor 1 interrupt status was incorrectly
assembled, when compared to the full table given in the same comment
section. The conversion into hex was also incorrect, leading to
incorrect interrupt status bitmask for sensor 1. This would cause the
driver to incorrectly identify changes for sensor 1, when in fact it
was sensor 0, or a sensor access time out.
Fix the binary and hex representations in the comments, and the actual
bitmask macro.
Fixes: f5f633b182 ("thermal/drivers/mediatek: Add the Low Voltage Thermal Sensor driver")
Signed-off-by: Chen-Yu Tsai <wenst@chromium.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230328031017.1360976-1-wenst@chromium.org
Thermal zones located in power domains may not be accessible when
the domain is powergated. In this situation, reading the temperature
will return -BPMP_EFAULT. When evaluating trips, BPMP will internally
use -256C as the temperature for offline zones.
For smooth operation, for offline zones, return -EAGAIN when reading
the temperature and allow registration of zones even if they are
offline during probe.
Signed-off-by: Mikko Perttunen <mperttunen@nvidia.com>
Acked-by: Thierry Reding <treding@nvidia.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230330094904.2589428-1-cyndis@kapsi.fi
Switch devm_reset_control_array_get() to
devm_reset_control_array_get_exclusive().
Signed-off-by: Ye Xingchen <ye.xingchen@zte.com.cn>
Reviewed-by: Philipp Zabel <p.zabel@pengutronix.de>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/202303241108553006227@zte.com.cn
Dynamically allocate the sensors array based on the amount
of platform sensors in preparation for rk3588 support, which
needs 7 sensors.
Reviewed-by: Heiko Stuebner <heiko@sntech.de>
Signed-off-by: Sebastian Reichel <sebastian.reichel@collabora.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230308112253.15659-6-sebastian.reichel@collabora.com
Replace the channel ID lookup table by a simple offset, since
the channel IDs are consecutive.
Signed-off-by: Sebastian Reichel <sebastian.reichel@collabora.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Heiko Stuebner <heiko@sntech.de>
Link: https://lore.kernel.org/r/20230308112253.15659-5-sebastian.reichel@collabora.com
Use dev_err_probe to simplify error printing in the driver's probe
routine.
Reviewed-by: Heiko Stuebner <heiko@sntech.de>
Signed-off-by: Sebastian Reichel <sebastian.reichel@collabora.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230308112253.15659-4-sebastian.reichel@collabora.com
By using devm_clk_get_enabled() the clock acquisition and
enabling can be done in one step with automatic error
handling.
Reviewed-by: Heiko Stuebner <heiko@sntech.de>
Signed-off-by: Sebastian Reichel <sebastian.reichel@collabora.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230308112253.15659-3-sebastian.reichel@collabora.com
It's possible to directly get the match data in a generic
way nowadays.
Reviewed-by: Heiko Stuebner <heiko@sntech.de>
Signed-off-by: Sebastian Reichel <sebastian.reichel@collabora.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230308112253.15659-2-sebastian.reichel@collabora.com
structure field directly, access the sensor device instead the
thermal zone's device for trace, relocate the traces in
drivers/thermal (Daniel Lezcano)
- Use the generic trip point for the i.MX and remove the get_trip_temp
ops (Daniel Lezcano)
- Use the devm_platform_ioremap_resource() in the Hisilicon driver
(Yang Li)
- Remove R-Car H3 ES1.* handling as public has only access to the ES2
version and the upstream support for the ES1 has been shutdown (Wolfram Sang)
- Add a delay after initializing the bank in order to let the time to
the hardware to initialze itself before reading the temperature
(Amjad Ouled-Ameur)
- Add MT8365 support (Amjad Ouled-Ameur)
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Merge tag 'thermal-v6.4-rc1-1' of ssh://gitolite.kernel.org/pub/scm/linux/kernel/git/thermal/linux
Pull thermal control material for 6.4-rc1 from Daniel Lezcano:
"- Add more thermal zone device encapsulation: prevent setting
structure field directly, access the sensor device instead the
thermal zone's device for trace, relocate the traces in
drivers/thermal (Daniel Lezcano)
- Use the generic trip point for the i.MX and remove the get_trip_temp
ops (Daniel Lezcano)
- Use the devm_platform_ioremap_resource() in the Hisilicon driver
(Yang Li)
- Remove R-Car H3 ES1.* handling as public has only access to the ES2
version and the upstream support for the ES1 has been shutdown (Wolfram
Sang)
- Add a delay after initializing the bank in order to let the time to
the hardware to initialze itself before reading the temperature
(Amjad Ouled-Ameur)
- Add MT8365 support (Amjad Ouled-Ameur)"
* tag 'thermal-v6.4-rc1-1' of ssh://gitolite.kernel.org/pub/scm/linux/kernel/git/thermal/linux:
thermal/drivers/ti: Use fixed update interval
thermal/drivers/stm: Don't set no_hwmon to false
thermal/drivers/db8500: Use driver dev instead of tz->device
thermal/core: Relocate the traces definition in thermal directory
thermal/drivers/hisi: Use devm_platform_ioremap_resource()
thermal/drivers/imx: Use the thermal framework for the trip point
thermal/drivers/imx: Remove get_trip_temp ops
thermal/drivers/rcar_gen3_thermal: Remove R-Car H3 ES1.* handling
thermal/drivers/mediatek: Add delay after thermal banks initialization
thermal/drivers/mediatek: Add support for MT8365 SoC
thermal/drivers/mediatek: Control buffer enablement tweaks
dt-bindings: thermal: mediatek: Add binding documentation for MT8365 SoC
Once thermal_list_lock has been acquired in
__thermal_cooling_device_register(), it is not necessary to drop it
and take it again until all of the thermal zones have been updated,
so change the code accordingly.
No expected functional impact.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Currently the TI thermal driver sets the sensor update interval based
on the polling of the thermal zone. In order to get the polling rate,
the code inspects the thermal zone device structure internals, thus
breaking the self-encapsulation of the thermal framework core
framework.
On the other side, we see the common polling rates set in the device
tree for the platforms using this driver are 500 or 1000 ms.
Setting the polling rate to 250 ms would be far enough to cover the
combination we found in the device tree.
Instead of accessing the thermal zone device structure polling rate,
let's use a common update interval of 250 ms for the driver.
Cc: Keerthy <j-keerthy@ti.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Dhruva Gole <d-gole@ti.com>
Acked-by: Keerthy <j-keerthy@ti.com>
Link: https://lore.kernel.org/r/20230307133735.90772-7-daniel.lezcano@linaro.org
The thermal->tzp->no_hwmon parameter is only used when calling
thermal_zone_device_register().
Setting it to 'false' before calling thermal_add_hwmon_sysfs() has no
effect.
Remove the call and again prevent the drivers to access the thermal
internals.
Cc: Maxime Coquelin <mcoquelin.stm32@gmail.com>
Cc: Alexandre Torgue <alexandre.torgue@foss.st.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230307133735.90772-6-daniel.lezcano@linaro.org
The db8500 driver uses the thermal zone device instead of the device
attached to it. In order to prevent the drivers to access the thermal
zone device structure, replace the thermal zone device by the driver
to show the debug message.
Cc: Linus Walleij <linus.walleij@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Linus Walleij <linus.walleij@linaro.org>
Link: https://lore.kernel.org/r/20230307133735.90772-5-daniel.lezcano@linaro.org
The traces are exported but only local to the thermal core code. On
the other side, the traces take the thermal zone device structure as
argument, thus they have to rely on the exported thermal.h header
file. As we want to move the structure to the private thermal core
header, first we have to relocate those traces to the same place as
many drivers do.
Cc: Steven Rostedt <rostedt@goodmis.org>
Suggested-by: Steven Rostedt <rostedt@goodmis.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Steven Rostedt (Google) <rostedt@goodmis.org>
Link: https://lore.kernel.org/r/20230307133735.90772-2-daniel.lezcano@linaro.org
According to commit 7945f929f1 ("drivers: provide
devm_platform_ioremap_resource()"), convert platform_get_resource(),
devm_ioremap_resource() to a single call to Use
devm_platform_ioremap_resource(), as this is exactly what this
function does.
Signed-off-by: Yang Li <yang.lee@linux.alibaba.com>
Link: https://lore.kernel.org/r/20230308062719.79522-1-yang.lee@linux.alibaba.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
The thermal framework provides an API to get the trip related to a
trip point id. We want to consolidate the generic trip points code,
thus preventing the different drivers to deal with the trip points
after they registered them.
The set_trip_temp ops will be changed regarding the above changes but
first we need to rework a bit the different implementation in the
drivers.
The goal is to prevent using the trip id but use a trip point passed
as parameter which will contain all the needed information.
As we don't have the trip point passed as parameter yet, we get the
trip point using the generic trip thermal framewrok APIs and use it to
take exactly the same decisions.
The difference with this change and the previous code is from where we
get the thermal trip point (which is the same).
No functional change intended.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Fabio Estevam <festevam@gmail.com>
Link: https://lore.kernel.org/r/20230309092821.1590586-2-daniel.lezcano@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
The i.MX thermal sensor uses the generic trip points. The thermal
framework can return the critical temperature directly.
Remove the pointless get_trip_temp ops.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Fabio Estevam <festevam@gmail.com>
Link: https://lore.kernel.org/r/20230309092821.1590586-1-daniel.lezcano@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
R-Car H3 ES1.* was only available to an internal development group and
needed a lot of quirks and workarounds. These become a maintenance
burden now, so our development group decided to remove upstream support
and disable booting for this SoC. Public users only have ES2 onwards.
Reviewed-by: Laurent Pinchart <laurent.pinchart+renesas@ideasonboard.com>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Link: https://lore.kernel.org/r/20230307163041.3815-7-wsa+renesas@sang-engineering.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Thermal sensor reads performed immediately after thermal bank
initialization returns bogus values. This is currently tackled by returning
0 if the temperature is bogus (exceeding 200000).
Instead, add a delay between the bank init and the thermal zone device
register to properly fix this.
Signed-off-by: Michael Kao <michael.kao@mediatek.com>
Signed-off-by: Hsin-Yi Wang <hsinyi@chromium.org>
Signed-off-by: Amjad Ouled-Ameur <aouledameur@baylibre.com>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Link: https://lore.kernel.org/r/20221018-up-i350-thermal-bringup-v9-5-55a1ae14af74@baylibre.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
When cpumask is specified as a module parameter the value is
overwritten by the module init routine. This can easily be fixed
by checking to see if the mask has already been allocated in the
init routine.
When max_idle is specified as a module parameter a panic will occur.
The problem is that the idle_injection_cpu_mask is not allocated until
the module init routine executes. This can easily be fixed by allocating
the cpumask if it's not already allocated.
Fixes: ebf5197102 ("thermal: intel: powerclamp: Add two module parameters")
Signed-off-by: David Arcari <darcari@redhat.com>
Reviewed-by: Srinivas Pandruvada<srinivas.pandruvada@linux.intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
It is preferred to use typed property access functions (i.e.
of_property_read_<type> functions) rather than low-level
of_get_property/of_find_property functions for reading properties. As
part of this, convert of_get_property/of_find_property calls to the
recently added of_property_present() helper when we just want to test
for presence of a property and nothing more.
Signed-off-by: Rob Herring <robh@kernel.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
For the sake of consistency, revert the second part of the
thermal_hwmon.c hunk from commit dec07d399c ("thermal: Don't use
'device' internal thermal zone structure field") after the first
part of it has been reverted.
Link: https://lore.kernel.org/linux-pm/5b084360-898b-aad0-0b8e-33acc585d71d@linaro.org
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Commit 52f04f10b9 ("thermal: intel: int340x: processor_thermal: Fix
deadlock") addressed deadlock issue during user space trip update. But it
missed a case when thermal zone device is disabled when user writes 0.
Call to thermal_zone_device_disable() also causes deadlock as it also
tries to lock tz->lock, which is already claimed by trip_point_temp_store()
in the thermal core code.
Remove call to thermal_zone_device_disable() in the function
sys_set_trip_temp(), which is called from trip_point_temp_store().
Fixes: 52f04f10b9 ("thermal: intel: int340x: processor_thermal: Fix deadlock")
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Cc: 6.2+ <stable@vger.kernel.org> # 6.2+
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
When the hwmon device node of a thermal zone device is not found,
using hwmon->device causes a kernel NULL pointer dereference.
Fixes: dec07d399c ("thermal: Don't use 'device' internal thermal zone structure field")
Reported-by: Preble Adam C <adam.c.preble@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The lockdep_assert_held() calls added to cooling_device_stats_setup()
and cooling_device_stats_destroy() by commit 790930f442 ("thermal:
core: Introduce thermal_cooling_device_update()") trigger false-positive
lockdep reports in code paths that are not subject to race conditions
(before cooling device registration and after cooling device removal).
For this reason, remove the lockdep_assert_held() calls from both
cooling_device_stats_setup() and cooling_device_stats_destroy() and
add one to thermal_cooling_device_stats_reinit() that has to be called
under the cdev lock.
Fixes: 790930f442 ("thermal: core: Introduce thermal_cooling_device_update()")
Link: https://lore.kernel.org/linux-acpi/ZCIDTLFt27Ei7+V6@ideak-desk.fi.intel.com
Reported-by: Imre Deak <imre.deak@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Commit 7c3d5c20dc ("thermal/core: Add a generic thermal_zone_get_trip()
function") stopped marking trip points with a zero temperature as
disabled, behavior that was originally introduced in commit 81ad4276b5
("Thermal: Ignore invalid trip points").
When using the mlxsw driver we see that when such trip points are not
disabled, the thermal subsystem repeatedly tries to set the state of the
associated cooling devices to the maximum state.
Address this by restoring the original behavior and mark trip points
with a zero temperature as disabled.
Fixes: 7c3d5c20dc ("thermal/core: Add a generic thermal_zone_get_trip() function")
Signed-off-by: Ido Schimmel <idosch@nvidia.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Introduce a core thermal API function, thermal_cooling_device_update(),
for updating the max_state value for a cooling device and rearranging
its statistics in sysfs after a possible change of its ->get_max_state()
callback return value.
That callback is now invoked only once, during cooling device
registration, to populate the max_state field in the cooling device
object, so if its return value changes, it needs to be invoked again
and the new return value needs to be stored as max_state. Moreover,
the statistics presented in sysfs need to be rearranged in general,
because there may not be enough room in them to store data for all
of the possible states (in the case when max_state grows).
The new function takes care of that (and some other minor things
related to it), but some extra locking and lockdep annotations are
added in several places too to protect against crashes in the cases
when the statistics are not present or when a stale max_state value
might be used by sysfs attributes.
Note that the actual user of the new function will be added separately.
Link: https://lore.kernel.org/linux-pm/53ec1f06f61c984100868926f282647e57ecfb2d.camel@intel.com/
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
Introduce a helper function, thermal_cooling_device_present(), for
checking if the given cooling device is in the list of registered
cooling devices to avoid some code duplication in a subsequent
patch.
No expected functional impact.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
When setting a trip point temperature from sysfs, there is an upper
bound check on the user input, but no lower bound check.
As hardware register has 7 bits for a trip point temperature, the offset
to tj_max of the input temperature must be equal to/less than 0x7f.
Or else,
1. bogus temperature is updated into the trip temperature bits.
2. the upper bits of the register can be polluted.
For example,
$ rdmsr 0x1b2
2000003
$ echo -180000 > /sys/class/thermal/thermal_zone1/trip_point_1_temp
$ rdmsr 0x1b2
3980003
Not only the trip point temp is set to 76C on this platform (tj_max is
100), the Power Notification (Bit 24) is also enabled erronously.
Fix the problem by adding lower bound check for sysfs input.
Reported-by: Dan Carpenter <error27@gmail.com>
Link: https://lore.kernel.org/all/add7a378-4d50-4ba1-81d3-a0c17db25a0b@kili.mountain/
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
MT8365 is similar to the other SoCs supported by the driver. It has only
one bank and 3 actual sensors that can be multiplexed. There is another
one sensor that does not have usable data.
Signed-off-by: Fabien Parent <fparent@baylibre.com>
Signed-off-by: Amjad Ouled-Ameur <aouledameur@baylibre.com>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Link: https://lore.kernel.org/r/20221018-up-i350-thermal-bringup-v9-3-55a1ae14af74@baylibre.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Add logic in order to be able to turn on the control buffer on MT8365.
This change now allows to have control buffer support for MTK_THERMAL_V1,
and it allows to define the register offset, and mask used to enable it.
Signed-off-by: Markus Schneider-Pargmann <msp@baylibre.com>
Signed-off-by: Fabien Parent <fparent@baylibre.com>
Signed-off-by: Amjad Ouled-Ameur <aouledameur@baylibre.com>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Link: https://lore.kernel.org/r/20221018-up-i350-thermal-bringup-v9-2-55a1ae14af74@baylibre.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Merge thermal control updates for 6.4-rc1:
- Add a thermal zone 'devdata' accessor and modify several drivers to
use it (Daniel Lezcano).
- Prevent drivers from using the 'device' internal thermal zone
structure field directly (Daniel Lezcano).
- Clean up the hwmon thermal driver (Daniel Lezcano).
- Add thermal zone id accessor and thermal zone type accessor
and prevent drivers from using thermal zone fields directly (Daniel
Lezcano).
- Clean up the acerhdf and tegra thermal drivers (Daniel Lezcano).
* thermal-core:
thermal/drivers/acerhdf: Remove pointless governor test
thermal/drivers/acerhdf: Make interval setting only at module load time
thermal/drivers/tegra: Remove unneeded lock when setting a trip point
thermal/hwmon: Use the thermal_core.h header
thermal/drivers/da9062: Don't access the thermal zone device fields
thermal: Use thermal_zone_device_type() accessor
thermal: Add a thermal zone id accessor
thermal/drivers/spear: Don't use tz->device but pdev->dev
thermal/core: Add thermal_zone_device structure 'type' accessor
thermal: Don't use 'device' internal thermal zone structure field
thermal/hwmon: Use the right device for devm_thermal_add_hwmon_sysfs()
thermal/hwmon: Do not set no_hwmon before calling thermal_add_hwmon_sysfs()
thermal: Remove debug or error messages in get_temp() ops
thermal/core: Show a debug message when get_temp() fails
thermal/core: Use the thermal zone 'devdata' accessor in remaining drivers
thermal/core: Use the thermal zone 'devdata' accessor in hwmon located drivers
thermal/core: Use the thermal zone 'devdata' accessor in thermal located drivers
thermal/core: Add a thermal zone 'devdata' accessor
The function tegra_tsensor_enable_hw_channel() takes the thermal zone
lock to prevent "a potential" race with a call to set_trips()
callback.
The driver must not play with the thermal framework core code
internals.
The tegra_tsensor_enable_hw_channel() is called by:
- the suspend / resume callbacks
- the probe function after the thermal zones are registered
The thermal zone lock taken in this function is supposed to protect
from a call to the set_trips() callback which writes in the same
register.
The potential race is when suspend / resume are called at the same
time as set_trips. This one is called only in
thermal_zone_device_update().
- At suspend time, the 'in_suspend' is set, thus the
thermal_zone_device_update() bails out immediately and set_trips is
not called during this moment.
- At resume time, the thermal zone is updated at PM_POST_SUSPEND,
thus the driver has already set the TH2 temperature.
- At probe time, we register the thermal zone and then we set the
TH2. The only scenario I can see so far is the interrupt fires, the
thermal_zone_update() is called exactly at the moment
tegra_tsensor_enable_hw_channel() a few lines after registering it.
Enable the channels before setting up the interrupt. We close the
potential race window without using the thermal zone's lock.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Suggested-by: Thierry Reding <thierry.reding@gmail.com>
Acked-by: Thierry Reding <treding@nvidia.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The thermal_hwmon is playing with the thermal core code
internals. Changing the code would be too invasive for now.
We can consider the thermal_hwmon.c is part of the thermal core code
as it provides a glue to tie the hwmon and the thermal zones.
Let's include the thermal_core.h header.
No functional change intended.
Cc: Jean Delvare <jdelvare@suse.com>
Cc: Guenter Roeck <linux@roeck-us.net>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Guenter Roeck <linux@roeck-us.net>
Reviewed-by: Jean Delvare <jdelvare@suse.de>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The driver is reading the passive polling rate in the thermal zone
structure. We want to prevent the drivers to rummage around in the
thermal zone structure.
On the other side, the delay is what the driver passed to the
thermal_zone_device_register() function, so it has already the
information.
Reuse the information we have instead of reading the information we
set.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Adam Ward <DLG-Adam.Ward.opensource@dm.renesas.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Replace the accesses to 'tz->type' by its accessor version in order to
self-encapsulate the thermal_zone_device structure.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Ido Schimmel <idosch@nvidia.com> #mlxsw
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> #MediaTek LVTS
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
In order to get the thermal zone id but without directly accessing the
thermal zone device structure, add an accessor.
Use the accessor in the hwmon_scmi and acpi_thermal.
No functional change intented.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Guenter Roeck <linux@roeck-us.net>
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Use the spear associated device instead of the thermal zone device
which belongs to the thermal framework internals.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The thermal zone device structure is exposed via the exported
thermal.h header. This structure should stay private the thermal core
code. In order to encapsulate the structure, let's add an accessor to
get the 'type' of the thermal zone.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Some drivers are directly using the thermal zone's 'device' structure
field.
Use the driver device pointer instead of the thermal zone device when
it is available.
Remove the traces when they are duplicate with the traces in the core
code.
Cc: Jean Delvare <jdelvare@suse.com>
Cc: Guenter Roeck <linux@roeck-us.net>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Balsam CHIHI <bchihi@baylibre.com> #Mediatek LVTS
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> #MediaTek LVTS
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The devres variant of thermal_add_hwmon_sysfs() only takes the thermal
zone structure pointer as parameter.
Actually, it uses the tz->device to add it in the devres list.
It is preferable to use the device registering the thermal zone
instead of the thermal zone device itself. That prevents the driver
accessing the thermal zone structure internals and it is from my POV
more correct regarding how devm_ is used.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Martin Blumenstingl <martin.blumenstingl@googlemail.com> #amlogic_thermal
Acked-by: Jernej Skrabec <jernej.skrabec@gmail.com> #sun8i_thermal
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> #MediaTek auxadc
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The thermal->tzp->no_hwmon parameter is only used when calling
thermal_zone_device_register().
Setting it to 'false' before calling thermal_add_hwmon_sysfs() has no
effect.
Remove the call and again prevent the drivers to access the thermal
internals.
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> #R-Car
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Florian Fainelli <f.fainelli@gmail.com> #Broadcom
Acked-by: Heiko Stuebner <heiko@sntech.de> #rockchip
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Some get_temp() ops implementation are showing an error or a debug
message if the reading of the sensor fails.
The debug message is already displayed from the call site of this
ops. So we can remove it.
On the other side, the error should not be displayed because in
production that can raise tons of messages.
Finally, some drivers are showing a debug message with the
temperature, this is also accessible through the trace from the core
code in the temperature_update() function.
Another benefit is the dev_* messages are accessing the thermal zone
device field from the structure, so we encapsulate even more the code
by preventing these accesses.
Remove those messages.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Miquel Raynal <miquel.raynal@bootlin.com> #Armada
Acked-by: Florian Fainelli <f.fainelli@gmail.com> #brcmstb_thermal.c
Acked-by: Heiko Stuebner <heiko@sntech.de> #rockchip
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The different thermal drivers are showing an error in case the
get_temp() fails. Actually no traces should be displayed in the
backend ops but in the call site of this ops.
Furthermore, the message is often a dev_dbg message where the
tz->device is used, thus using the internal of the structure from the
driver.
Show a debug message if the thermal_zone_get_temp() fails to read the
sensor temperature, so code showing the message is factored out and
the tz->device accesss is in the scope of the thermal core framework.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The thermal zone device structure is exposed to the different drivers
and obviously they access the internals while that should be
restricted to the core thermal code.
In order to self-encapsulate the thermal core code, we need to prevent
the drivers accessing directly the thermal zone structure and provide
accessor functions to deal with.
Use the devdata accessor introduced in the previous patch.
No functional changes intended.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> #R-Car
Acked-by: Mark Brown <broonie@kernel.org>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> #MediaTek auxadc and lvts
Reviewed-by: Balsam CHIHI <bchihi@baylibre.com> #Mediatek lvts
Reviewed-by: Adam Ward <DLG-Adam.Ward.opensource@dm.renesas.com> #da9062
Reviewed-by: Baolin Wang <baolin.wang@linux.alibaba.com> #spread
Acked-by: Jernej Skrabec <jernej.skrabec@gmail.com> #sun8i_thermal
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Florian Fainelli <f.fainelli@gmail.com> #Broadcom
Reviewed-by: Dhruva Gole <d-gole@ti.com> # K3 bandgap
Acked-by: Linus Walleij <linus.walleij@linaro.org>
Acked-by: Heiko Stuebner <heiko@sntech.de> #rockchip
Reviewed-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com> #uniphier
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The thermal zone device structure is exposed to the different drivers
and obviously they access the internals while that should be
restricted to the core thermal code.
In order to self-encapsulate the thermal core code, we need to prevent
the drivers accessing directly the thermal zone structure and provide
accessor functions to deal with.
Provide an accessor to the 'devdata' structure and make use of it in
the different drivers.
No functional changes intended.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Mark Brown <broonie@kernel.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
When user space updates the trip point there is a deadlock, which results
in caller gets blocked forever.
Commit 05eeee2b51 ("thermal/core: Protect sysfs accesses to thermal
operations with thermal zone mutex"), added a mutex for tz->lock in the
function trip_point_temp_store(). Hence, trip set callback() can't
call any thermal zone API as they are protected with the same mutex lock.
The callback here calling thermal_zone_device_enable(), which will result
in deadlock.
Move the thermal_zone_device_enable() to proc_thermal_pci_probe() to
avoid this deadlock.
Fixes: 05eeee2b51 ("thermal/core: Protect sysfs accesses to thermal operations with thermal zone mutex")
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@intel.com>
Cc: 6.2+ <stable@vger.kernel.org> # 6.2+
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
- Fix an error pointer dereference in the quark_dts Intel thermal
driver (Dan Carpenter).
- Fix the intel_bxt_pmic_thermal driver Kconfig entry to select REGMAP
which is not user-visible instead of depending on it (Randy Dunlap).
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Merge tag 'thermal-6.3-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm
Pull more thermal control updates from Rafael Wysocki:
"These fix two issues in the Intel thermal control drivers.
Specifics:
- Fix an error pointer dereference in the quark_dts Intel thermal
driver (Dan Carpenter)
- Fix the intel_bxt_pmic_thermal driver Kconfig entry to select
REGMAP which is not user-visible instead of depending on it (Randy
Dunlap)"
* tag 'thermal-6.3-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm:
thermal: intel: BXT_PMIC: select REGMAP instead of depending on it
thermal: intel: quark_dts: fix error pointer dereference
REGMAP is a hidden (not user visible) symbol. Users cannot set it
directly thru "make *config", so drivers should select it instead of
depending on it if they need it.
Consistently using "select" or "depends on" can also help reduce
Kconfig circular dependency issues.
Therefore, change the use of "depends on REGMAP" to "select REGMAP".
Fixes: b474303ffd ("thermal: add Intel BXT WhiskeyCove PMIC thermal driver")
Signed-off-by: Randy Dunlap <rdunlap@infradead.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
If alloc_soc_dts() fails, then we can just return. Trying to free
"soc_dts" will lead to an Oops.
Fixes: 8c18769396 ("thermal: intel Quark SoC X1000 DTS thermal driver")
Signed-off-by: Dan Carpenter <error27@gmail.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
As usual, there are lots of minor driver changes across SoC platforms
from NXP, Amlogic, AMD Zynq, Mediatek, Qualcomm, Apple and Samsung.
These usually add support for additional chip variations in existing
drivers, but also add features or bugfixes.
The SCMI firmware subsystem gains a unified raw userspace interface
through debugfs, which can be used for validation purposes.
Newly added drivers include:
- New power management drivers for StarFive JH7110, Allwinner D1 and
Renesas RZ/V2M
- A driver for Qualcomm battery and power supply status
- A SoC device driver for identifying Nuvoton WPCM450 chips
- A regulator coupler driver for Mediatek MT81xxv
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Merge tag 'soc-drivers-6.3' of git://git.kernel.org/pub/scm/linux/kernel/git/soc/soc
Pull ARM SoC driver updates from Arnd Bergmann:
"As usual, there are lots of minor driver changes across SoC platforms
from NXP, Amlogic, AMD Zynq, Mediatek, Qualcomm, Apple and Samsung.
These usually add support for additional chip variations in existing
drivers, but also add features or bugfixes.
The SCMI firmware subsystem gains a unified raw userspace interface
through debugfs, which can be used for validation purposes.
Newly added drivers include:
- New power management drivers for StarFive JH7110, Allwinner D1 and
Renesas RZ/V2M
- A driver for Qualcomm battery and power supply status
- A SoC device driver for identifying Nuvoton WPCM450 chips
- A regulator coupler driver for Mediatek MT81xxv"
* tag 'soc-drivers-6.3' of git://git.kernel.org/pub/scm/linux/kernel/git/soc/soc: (165 commits)
power: supply: Introduce Qualcomm PMIC GLINK power supply
soc: apple: rtkit: Do not copy the reg state structure to the stack
soc: sunxi: SUN20I_PPU should depend on PM
memory: renesas-rpc-if: Remove redundant division of dummy
soc: qcom: socinfo: Add IDs for IPQ5332 and its variant
dt-bindings: arm: qcom,ids: Add IDs for IPQ5332 and its variant
dt-bindings: power: qcom,rpmpd: add RPMH_REGULATOR_LEVEL_LOW_SVS_L1
firmware: qcom_scm: Move qcom_scm.h to include/linux/firmware/qcom/
MAINTAINERS: Update qcom CPR maintainer entry
dt-bindings: firmware: document Qualcomm SM8550 SCM
dt-bindings: firmware: qcom,scm: add qcom,scm-sa8775p compatible
soc: qcom: socinfo: Add Soc IDs for IPQ8064 and variants
dt-bindings: arm: qcom,ids: Add Soc IDs for IPQ8064 and variants
soc: qcom: socinfo: Add support for new field in revision 17
soc: qcom: smd-rpm: Add IPQ9574 compatible
soc: qcom: pmic_glink: remove redundant calculation of svid
soc: qcom: stats: Populate all subsystem debugfs files
dt-bindings: soc: qcom,rpmh-rsc: Update to allow for generic nodes
soc: qcom: pmic_glink: add CONFIG_NET/CONFIG_OF dependencies
soc: qcom: pmic_glink: Introduce altmode support
...
The syscfg based thermal driver is only supporting STiH415 STiH416 and
STiD127 platforms which are all no more supported. We can thus safely
remove this driver since the remaining STi platform STiH407/STiH410
and STiH418 are all using the memmap based thermal driver.
Signed-off-by: Alain Volmat <avolmat@me.com>
Link: https://lore.kernel.org/r/20230209091659.1409-7-avolmat@me.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
As the name states "thermal_core.h" is the header file for the core
components of the thermal framework.
Too many drivers are including it. Hopefully the recent cleanups
helped to self encapsulate the code a bit more and prevented the
drivers to need this header.
Remove this inclusion in every place where it is possible.
Some other drivers did a confusion with the core header and the one
exported in linux/thermal.h. They include the former instead of the
latter. The changes also fix this.
The tegra/soctherm driver still remains as it uses an internal
function which need to be replaced.
The Intel HFI driver uses the netlink internal framework core and
should be changed to prevent to deal with the internals.
No functional changes intended.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Miquel Raynal <miquel.raynal@bootlin.com> # armada_thermal.c
Reviewed-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com> # uniphier_thermal.c
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> # rcar_gen3_thermal.c
Reviewed-by: Neil Armstrong <neil.armstrong@linaro.org> # amlogic_thermal.c
Acked-by: Florian Fainelli <f.fainelli@gmail.com> # bcm2835_thermal.c
Acked-by: Thierry Reding <treding@nvidia.com> # tegra30-tsensor.c
Link: https://lore.kernel.org/r/20230206153432.1017282-1-daniel.lezcano@linaro.org
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The commit 74c8e6bffb ("driver core: Add __alloc_size hint to devm
allocators") exposes a panic "BRK handler: Fatal exception" on the
hi3660_thermal_probe funciton.
This is because the function allocates memory for only one
sensors array entry, but tries to fill up a second one.
Fix this by removing the unneeded second access.
Fixes: 7d3a2a2bba ("thermal/drivers/hisi: Fix number of sensors on hi3660")
Signed-off-by: Yongqin Liu <yongqin.liu@linaro.org>
Link: https://lore.kernel.org/linux-mm/20221101223321.1326815-5-keescook@chromium.org/
Link: https://lore.kernel.org/r/20230210141507.71014-1-yongqin.liu@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The thermal zone is registered before the device is register and the
thermal coefficients are calculated, providing a window for very
incorrect readings.
The reason why the zone was register before the device was fully
initialized was that the presence of the set_trips() callback is used to
determine if the driver supports interrupt or not, as it is not defined
if the device is incapable of interrupts.
Fix this by using the operations structure in the private data instead
of the zone to determine if interrupts are available or not, and
initialize the device before registering the zone.
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Link: https://lore.kernel.org/r/20230208190333.3159879-4-niklas.soderlund+renesas@ragnatech.se
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The callback operations are modified on a driver global level. If one
device tree description do not define interrupts, the set_trips()
operation was disabled globally for all users of the driver.
Fix this by creating a device local copy of the operations structure and
modify the copy depending on what the device can do.
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Link: https://lore.kernel.org/r/20230208190333.3159879-3-niklas.soderlund+renesas@ragnatech.se
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
There is no need to explicitly call set_trips() when resuming from
suspend. The thermal framework calls thermal_zone_device_update() that
restores the trip points.
Suggested-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Link: https://lore.kernel.org/r/20230208190333.3159879-2-niklas.soderlund+renesas@ragnatech.se
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Add support for the Thermal Sensor/Chip Internal Voltage Monitor/Core
Voltage Monitor (THS/CIVM/CVM) on the Renesas R-Car V4H (R8A779G0) SoC.
According to the R-Car V4H Hardware User's Manual Rev. 0.70, the
(preliminary) conversion formula for the thermal sensor is the same as
for most other R-Car Gen3 and Gen4 SoCs, while the (preliminary)
conversion formula for the chip internal voltage monitor differs.
As the driver only uses the former, no further changes are needed.
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Link: https://lore.kernel.org/r/852048eb5f4cc001be7a97744f4c5caea912d071.1675958665.git.geert+renesas@glider.be
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The Low Voltage Thermal Sensor (LVTS) is a multiple sensors, multi
controllers contained in a thermal domain.
A thermal domains can be the MCU or the AP.
Each thermal domains contain up to seven controllers, each thermal
controller handle up to four thermal sensors.
The LVTS has two Finite State Machines (FSM), one to handle the
functionin temperatures range like hot or cold temperature and another
one to handle monitoring trip point. The FSM notifies via interrupts
when a trip point is crossed.
The interrupt is managed at the thermal controller level, so when an
interrupt occurs, the driver has to find out which sensor triggered
such an interrupt.
The sampling of the thermal can be filtered or immediate. For the
former, the LVTS measures several points and applies a low pass
filter.
Signed-off-by: Balsam CHIHI <bchihi@baylibre.com>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
On MT8195 Tomato Chromebook:
Tested-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Link: https://lore.kernel.org/r/20230209105628.50294-5-bchihi@baylibre.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Add MediaTek proprietary folder to upstream more thermal zone and cooler
drivers, relocate the original thermal controller driver to it, and rename it
as "auxadc_thermal.c" to show its purpose more clearly.
Signed-off-by: Balsam CHIHI <bchihi@baylibre.com>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Link: https://lore.kernel.org/r/20230209105628.50294-2-bchihi@baylibre.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Merge thermal control changes related to Intel platforms for 6.3-rc1:
- Rework ACPI helper functions for thermal control to retrieve a trip
point temperature instead of initializing a trip point objetc (Rafael
Wysocki).
- Clean up and improve the int340x thermal driver ((Rafael Wysocki).
- Simplify and clean up the intel_pch thermal driver ((Rafael Wysocki).
- Fix the Intel powerclamp thermal driver and make it use the common
idle injection framework (Srinivas Pandruvada).
- Add two module parameters, cpumask and max_idle, to the Intel powerclamp
thermal driver to allow it to affect only a specific subset of CPUs
instead of all of them (Srinivas Pandruvada).
- Make the Intel quark_dts thermal driver Use generic trip point
objects instead of its own trip point representation (Daniel
Lezcano).
- Add toctree entry for thermal documents and fix two issues in the
Intel powerclamp driver documentation (Bagas Sanjaya).
* thermal-intel: (25 commits)
Documentation: powerclamp: Fix numbered lists formatting
Documentation: powerclamp: Escape wildcard in cpumask description
Documentation: admin-guide: Add toctree entry for thermal docs
thermal: intel: powerclamp: Add two module parameters
Documentation: admin-guide: Move intel_powerclamp documentation
thermal: intel: powerclamp: Fix duration module parameter
thermal: intel: powerclamp: Return last requested state as cur_state
thermal: intel: quark_dts: Use generic trip points
thermal: intel: powerclamp: Use powercap idle-inject feature
powercap: idle_inject: Add update callback
powercap: idle_inject: Export symbols
thermal: intel: powerclamp: Fix cur_state for multi package system
thermal: intel: intel_pch: Drop struct board_info
thermal: intel: intel_pch: Rename board ID symbols
thermal: intel: intel_pch: Fold suspend and resume routines into their callers
thermal: intel: intel_pch: Fold two functions into their callers
thermal: intel: intel_pch: Eliminate device operations object
thermal: intel: intel_pch: Rename device operations callbacks
thermal: intel: intel_pch: Eliminate redundant return pointers
thermal: intel: intel_pch: Make pch_wpt_add_acpi_psv_trip() return int
...
Merge thermal control core changes for 6.3-rc1:
- Clean up thermal device unregistration code (Viresh Kumar).
- Fix and clean up thermal control core initialization error code
paths (Daniel Lezcano).
- Relocate the trip points handling code into a separate file (Daniel
Lezcano).
- Make the thermal core fail registration of thermal zones and cooling
devices if the thermal class has not been registered (Rafael Wysocki).
- Make the core thermal control code use sysfs_emit_at() instead of
scnprintf() where applicable (ye xingchen).
* thermal-core:
thermal: core: Use sysfs_emit_at() instead of scnprintf()
thermal: Fail object registration if thermal class is not registered
thermal/core: Move the thermal trip code to a dedicated file
thermal/core: Remove unneeded ida_destroy()
thermal/core: Fix unregistering netlink at thermal init time
thermal: core: Use device_unregister() instead of device_del/put()
thermal: core: Move cdev cleanup to thermal_release()
The qcom_scm.h file is moved into firmware/qcom, to avoid having any
Qualcomm-specific files directly in include/linux.
Support for PMIC GLINK is introduced, which on newer Qualcomm platforms
provides an interface to the firmware implementing battery management
and USB Type-C handling. Together with the base driver comes the custom
altmode support driver.
SMD RPM gains support for IPQ9574, and socinfo is extended with support
for revision 17 of the information format and soc_id for IPQ5332 and
IPQ8064 are added.
The qcom_stats is changes not to fail when not all parts are
initialized.
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Merge tag 'qcom-drivers-for-6.3-2' of https://git.kernel.org/pub/scm/linux/kernel/git/qcom/linux into soc/drivers
More Qualcomm driver updates for 6.3
The qcom_scm.h file is moved into firmware/qcom, to avoid having any
Qualcomm-specific files directly in include/linux.
Support for PMIC GLINK is introduced, which on newer Qualcomm platforms
provides an interface to the firmware implementing battery management
and USB Type-C handling. Together with the base driver comes the custom
altmode support driver.
SMD RPM gains support for IPQ9574, and socinfo is extended with support
for revision 17 of the information format and soc_id for IPQ5332 and
IPQ8064 are added.
The qcom_stats is changes not to fail when not all parts are
initialized.
* tag 'qcom-drivers-for-6.3-2' of https://git.kernel.org/pub/scm/linux/kernel/git/qcom/linux:
soc: qcom: socinfo: Add IDs for IPQ5332 and its variant
dt-bindings: arm: qcom,ids: Add IDs for IPQ5332 and its variant
dt-bindings: power: qcom,rpmpd: add RPMH_REGULATOR_LEVEL_LOW_SVS_L1
firmware: qcom_scm: Move qcom_scm.h to include/linux/firmware/qcom/
MAINTAINERS: Update qcom CPR maintainer entry
dt-bindings: firmware: document Qualcomm SM8550 SCM
dt-bindings: firmware: qcom,scm: add qcom,scm-sa8775p compatible
soc: qcom: socinfo: Add Soc IDs for IPQ8064 and variants
dt-bindings: arm: qcom,ids: Add Soc IDs for IPQ8064 and variants
soc: qcom: socinfo: Add support for new field in revision 17
soc: qcom: smd-rpm: Add IPQ9574 compatible
soc: qcom: pmic_glink: remove redundant calculation of svid
soc: qcom: stats: Populate all subsystem debugfs files
dt-bindings: soc: qcom,rpmh-rsc: Update to allow for generic nodes
soc: qcom: pmic_glink: add CONFIG_NET/CONFIG_OF dependencies
soc: qcom: pmic_glink: Introduce altmode support
soc: qcom: pmic_glink: Introduce base PMIC GLINK driver
dt-bindings: soc: qcom: Introduce PMIC GLINK binding
soc: qcom: dcc: Drop driver for now
Link: https://lore.kernel.org/r/20230210182242.2023901-1-andersson@kernel.org
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
In some use cases, it is desirable to only inject idle on certain set
of CPUs. For example on Alder Lake systems, it is possible that we force
idle only on P-Cores for thermal reasons. Also the idle percent can be
more than 50% if we only choose partial set of CPUs in the system.
Introduce 2 new module parameters for this purpose. They can be only
changed when the cooling device is inactive.
cpumask (Read/Write): A bit mask of CPUs to inject idle. The format of
this bitmask is same as used in other subsystems like in
/proc/irq/*/smp_affinity. The mask is comma separated 32 bit groups.
Each CPU is one bit. For example for 256 CPU system the full mask is:
ffffffff,ffffffff,ffffffff,ffffffff,ffffffff,ffffffff,ffffffff,ffffffff
The rightmost mask is for CPU 0-32.
max_idle (Read/Write): Maximum injected idle time to the total CPU time
ratio in percent range from 1 to 100. Even if the cooling device max_state
is always 100 (100%), this parameter allows to add a max idle percent
limit. The default is 50, to match the current implementation of powerclamp
driver. Also doesn't allow value more than 75, if the cpumask includes
every CPU present in the system.
Also when the cpumask doesn't include every CPU, there is no use of
compensation using package C-state idle counters. Hence don't start
package C-state polling thread even for a single package or a single die
system in this case.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Follow the advice in Documentation/filesystems/sysfs.rst that show()
should only use sysfs_emit() or sysfs_emit_at() when formatting the
value to be returned to user space.
Signed-off-by: ye xingchen <ye.xingchen@zte.com.cn>
[ rjw: Subject and changelog edits ]
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
After the switch to use the powercap/idle-inject framework in the Intel
powerclamp driver, the idle duration unit is microsecond.
However, the module parameter for idle duration is in milliseconds, so
convert it to microseconds in the "set" callback and back to milliseconds
in a new "get" callback.
While here, also use mutex protection for setting and getting "duration".
The other uses of "duration" are already protected by the mutex.
Fixes: 8526eb7fc7 ("thermal: intel: powerclamp: Use powercap idle-inject feature")
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
[ rjw: Subject and changelog edits ]
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Move include/linux/qcom_scm.h to include/linux/firmware/qcom/qcom_scm.h.
This removes 1 of a few remaining Qualcomm-specific headers into a more
approciate subdirectory under include/.
Suggested-by: Bjorn Andersson <andersson@kernel.org>
Signed-off-by: Elliot Berman <quic_eberman@quicinc.com>
Reviewed-by: Guru Das Srinagesh <quic_gurus@quicinc.com>
Acked-by: Mukesh Ojha <quic_mojha@quicinc.com>
Signed-off-by: Bjorn Andersson <andersson@kernel.org>
Link: https://lore.kernel.org/r/20230203210956.3580811-1-quic_eberman@quicinc.com
When the user is reading cur_state from the thermal cooling device for
Intel powerclamp device:
- It returns the idle ratio from Package C-state counters when
there is active idle injection session.
- -1, when there is no active idle injection session.
This information is not very useful as the package C-state counters vary
a lot from read to read. Instead just return the last requested cur_state.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Make the intel_quark_dts_thermal driver register an array of generic
trip points along with the thermal zone and drop the trip points
thermal zone callbacks that are not used any more from it.
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
[ rjw: Subject and changelog edits ]
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
There are two idle injection implementation in the Linux kernel. One
via intel_powerclamp and the other using powercap/idle_inject. Both
implementation end up in calling play_idle* function from a FIFO
priority thread. Both can't be used at the same time.
It is better to use one idle injection framework for better
maintainability. In this way, there is only one caller for play_idle.
Here powercap/idle_inject can be used for both per-core and for system
wide idle injection. This framework has a well defined interface which
allow registry for per-core or for all CPUs (system wide).
This reduces code complexity in the intel powerclamp driver as all the
per CPU kthreads, delayed work and calls to play_idle can be removed.
The changes include:
- Remove unneeded include files
- Remove per CPU kthread workers: balancing_work and idle_injection_work.
- Reuse the compensation related code by moving from previous worker
thread to idle_injection callback.
- Adjust the idle_duration and runtime by using powercap/idle_inject
interface.
- Remove all variables, which are not required once powercap/idle_inject
is used.
- Add mutex to avoid race during removal of idle injection during module
unload and user action to change idle inject percent. Also for
protection during dynamic adjustment of run and idle time from
update() callback.
- Remove online/offline callbacks to designate control CPU
- Use cpu_present_mask global variable for CPU mask
- Remove hot plug locks
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The powerclamp cooling device cur_state shows actual idle observed by
package C-state idle counters. But the implementation is not sufficient
for multi package or multi die system. The cur_state value is incorrect.
On these systems, these counters must be read from each package/die and
somehow aggregate them. But there is no good method for aggregation.
It was not a problem when explicit CPU model addition was required to
enable intel powerclamp. In this way certain CPU models could have
been avoided. But with the removal of CPU model check with the
availability of Package C-state counters, the driver is loaded on most
of the recent systems.
For multi package/die systems, just show the actual target idle state,
the system is trying to achieve. In powerclamp this is the user set
state minus one.
Also there is no use of starting a worker thread for polling package
C-state counters and applying any compensation for multiple package
or multiple die systems.
Fixes: b721ca0d19 ("thermal/powerclamp: remove cpu whitelist")
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Cc: 4.14+ <stable@vger.kernel.org> # 4.14+
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Because the only member of struct board_info is the name, the
board_info[] array of struct board_info elements can be replaced with
an array of strings.
Modify the code accordingly and drop struct board_info.
No intentional functional impact.
Suggested-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
Use capitals in the names of the board ID symbols and add the PCH_
prefix to each of them for consistency.
Also rename the board_ids enum accordingly.
No intentional functional impact.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
Fold pch_suspend() and pch_resume(), that each have only one caller,
into their respective callers to make the code somewhat easier to
follow.
No intentional functional impact.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
Fold two functions, pch_hw_init() and pch_get_temp(), that each have
only one caller, into their respective callers to make the code somewhat
easier to follow.
No intentional functional impact.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
The same device operations object is pointed to by all of the board
configurations in the driver, so effectively the same operations
callbacks are used by all of them which only adds overhead (that can
be significant due to retpolines) for no real purpose.
For this reason, drop the device operations object and replace the
respective callback invocations by direct calls to the specific
functions that were previously pointed to by callback pointers.
No intentional change in behavior.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
Because the same device operations callbacks are used for all supported
boards, they are in fact generic, so rename them to reflect that.
Also rename the operations object itself for consistency.
No intentional functional impact.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
Both pch_wpt_init() and pch_wpt_get_temp() can return the proper
result via their return values, so they do not need to use return
pointers.
Modify them accordingly.
No intentional functional impact.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
Modify pch_wpt_add_acpi_psv_trip() to return an int value instead of
using a return pointer for that.
While at it, drop an excessive empty code line.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
Instead of using snprintf() to populate the ACPI object name in
int340x_thermal_set_trip_temp(), use an appropriate initializer
and make the function fail if its trip argument is greater than 9,
because ACPI object names can only be 4 characters long and it does
not make sense to even try to evaluate objects with longer names (that
argument is guaranteed to be non-negative, because it comes from the
thermal code that will not pass negative trip numbers to zone
callbacks).
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
The explicit casting from int to unsigned long in
int340x_thermal_get_zone_temp() is pointless, becuase the multiplication
result is cast back to int by the assignment in the same statement, so
drop it.
No expected functional impact.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
Rename local variables int34x_thermal_zone in int340x_thermal_zone_add()
and int340x_thermal_zone_remove() to int34x_zone which allows a number
of code lines to be shorter and easier to read and adjust some white
space for consistency.
No intentional functional impact.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
Improve some inconsistent usage of white space in int340x_thermal_zone.c,
fix up one coding style issue in it (missing braces around an else
branch of a conditional) and while at it replace a !ACPI_FAILURE()
check with an equivalent ACPI_SUCCESS() one.
No intentional functional impact.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
It is slightly better to make the ACPI thermal helper functions retrieve
the trip point temperature only instead of doing the full trip point
initialization, because they are also used for updating some already
registered trip points, in which case initializing a new trip just
in order to update the temperature of an existing one is somewhat
wasteful.
Modify the ACPI thermal helpers accordingly and update their users.
No intentional functional impact.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Merge changes affecting thermal control on Intel platforms for 6.3-rc1:
- Consolidate code accessing the Intel TCC (Thermal Control Circuitry)
MSRs by introducing library functions for that and making the
TCC-related code in thermal drivers use them (Zhang Rui).
- Enhance the x86_pkg_temp_thermal driver to support dynamic tjmax
changes (Zhang Rui).
- Address an "unsigned expression compared with zero" warning in the
intel_soc_dts_iosf thermal driver (Yang Li).
- Update comments regarding two functions in the Intel Menlow thermal
driver (Deming Wang).
- Use sysfs_emit_at() instead of scnprintf() in the int340x thermal
driver (ye xingchen).
- Make the intel_pch thermal driver support the Wellsburg PCH (Tim
Zimmermann).
- Add trip point initialization helper functions for ACPI-defined trip
points and modify two thermal drivers to use them (Rafael Wysocki,
Daniel Lezcano).
- Modify the intel_pch and processor_thermal_device_pci thermal drivers
use generic trip point tables instead of thermal zone trip point
callbacks (Daniel Lezcano).
- Add production mode attribute sysfs attribute to the int340x thermal
driver (Srinivas Pandruvada).
- Rework dynamic trip point updates handling and locking in the int340x
thermal driver (Rafael Wysocki).
- Make the int340x thermal driver use a generic trip points table
instead of thermal zone trip point callbacks (Rafael Wysocki, Daniel
Lezcano).
* thermal-intel:
thermal: intel: int340x: Use generic trip points table
thermal: intel: int340x: Use zone lock for synchronization
thermal: intel: int340x: Rework updating trip points
thermal: ACPI: Initialize trips if temperature is out of range
thermal: intel: processor_thermal_device_pci: Use generic trip point
thermal: intel: int340x: Add production mode attribute
thermal: intel: intel_pch: Use generic trip points
thermal: ACPI: Add ACPI trip point routines
thermal: intel: intel_pch: Add support for Wellsburg PCH
thermal: int340x_thermal: Use sysfs_emit_at() instead of scnprintf()
thermal: intel: menlow: Update function descriptions
thermal: intel: Fix unsigned comparison with less than zero
thermal/x86_pkg_temp_thermal: Add support for handling dynamic tjmax
thermal/x86_pkg_temp_thermal: Use Intel TCC library
thermal/intel/intel_tcc_cooling: Use Intel TCC library
thermal/intel/intel_soc_dts_iosf: Use Intel TCC library
thermal/int340x/processor_thermal: Use Intel TCC library
thermal/intel: Introduce Intel TCC library
Modify int340x_thermal_zone_add() to register the thermal zone along
with a trip points table, which allows the trip-related zone callbacks
to be dropped, because they are not needed any more.
In order to consolidate the code, use ACPI trip library functions to
populate generic trip points in int340x_thermal_read_trips() and to
update them in int340x_thermal_update_trips().
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Co-developed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Because the ->get_trip_temp() and ->get_trip_type() thermal zone
callbacks are only invoked from __thermal_zone_get_trip() which is
always called by the thermal core under the zone lock, it is sufficient
for int340x_thermal_update_trips() to acquire the zone lock for mutual
exclusion with those callbacks.
Accordingly, modify int340x_thermal_update_trips() to use the zone lock
instead of the internal trip_mutex and drop the latter which is not
necessary any more.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
It is generally invalid to change the trip point indices after they have
been exposed via sysfs.
Moreover, the thermal objects in the ACPI namespace cannot go away and
appear on the fly. In practice, the only thing that can happen when the
INT3403_PERF_TRIP_POINT_CHANGED notification is sent by the platform
firmware is a change of the return values of those thermal objects.
For this reason, add a special function for updating the trip point
temperatures after re-evaluating the respective ACPI thermal objects
and change int3403_notify() to invoke it instead of
int340x_thermal_read_trips() that would change the trip point indices
on errors. Also remove the locking from the latter, because it is only
called before registering the thermal zone and it cannot race with the
zone's callbacks.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
In some cases it is still useful to register a trip point if the
temperature returned by the corresponding ACPI thermal object (for
example, _HOT) is invalid to start with, because the same ACPI
thermal object may start to return a valid temperature after a
system configuration change (for example, from an AC power source
to battery an vice versa).
For this reason, if the ACPI thermal object evaluated by
thermal_acpi_trip_init() successfully returns a temperature value that
is out of the range of values taken into account, initialize the trip
point using THERMAL_TEMP_INVALID as the temperature value instead of
returning an error to allow the user of the trip point to decide what
to do with it.
Also update pch_wpt_add_acpi_psv_trip() to reject trip points with
invalid temperature values.
Fixes: 7a0e397488 ("thermal: ACPI: Add ACPI trip point routines")
Reported-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
(Randy Dunlap)
- Add the missing 'qcom,adc-tm7' compatible string in the dt-bindings
(Krzysztof Kozlowski)
- Improve the calibration routine by relying on the nvmem to read the
values and provide a set of fixes for the QCom tsens driver (Dmitry
Baryshkov)
- Remove the duplicate interrupt setting routine in the QCom tsens
driver (Daniel Lezcano)
- Fix a wrong loop condition in the i.MX SC thermal driver and add the
iMX8QM sensors (Viorel Suman)
- Fix header inclusion asm-generic.h by asm.h for the
qcom-spmi-adc-tm5 driver (Andy Shevchenko)
- Use the devm_platform_get_and_ioremap_resource() combo function in
all the drivers where the conversion applies (Ye Xingchen)
- Replace a literal mask by an existing corresponding macro (Yangtao
Li)
- Add support for MT7986 and MT7981 (Daniel Golle)
- Use thermal_zone_get_crit_temp() for the Armada thermal driver
(Daniel Lezcano)
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Merge tag 'thermal-v6.3-rc1' of ssh://gitolite.kernel.org/pub/scm/linux/kernel/git/thermal/linux into thermal-next
Pull thermal control material for 6.3-rc1 from Daniel Lezcano:
"- Fix kerneldoc format errors for Rockchip, Mediatek and Uniphier
(Randy Dunlap)
- Add the missing 'qcom,adc-tm7' compatible string in the dt-bindings
(Krzysztof Kozlowski)
- Improve the calibration routine by relying on the nvmem to read the
values and provide a set of fixes for the QCom tsens driver (Dmitry
Baryshkov)
- Remove the duplicate interrupt setting routine in the QCom tsens
driver (Daniel Lezcano)
- Fix a wrong loop condition in the i.MX SC thermal driver and add the
iMX8QM sensors (Viorel Suman)
- Fix header inclusion asm-generic.h by asm.h for the
qcom-spmi-adc-tm5 driver (Andy Shevchenko)
- Use the devm_platform_get_and_ioremap_resource() combo function in
all the drivers where the conversion applies (Ye Xingchen)
- Replace a literal mask by an existing corresponding macro (Yangtao
Li)
- Add support for MT7986 and MT7981 (Daniel Golle)
- Use thermal_zone_get_crit_temp() for the Armada thermal driver
(Daniel Lezcano)"
* tag 'thermal-v6.3-rc1' of ssh://gitolite.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (35 commits)
thermal/drivers/armada: Use the thermal_zone_get_crit_temp()
thermal/drivers/mtk: Add support for MT7986 and MT7981
thermal/drivers/mtk: Use function pointer for raw_to_mcelsius
thermal/drivers/sun8i: Convert to use macro
thermal/drivers/spear: Use devm_platform_get_and_ioremap_resource()
thermal/drivers/kirkwood: Use devm_platform_get_and_ioremap_resource()
thermal/drivers/thermal_mmio: Use devm_platform_get_and_ioremap_resource()
thermal/drivers/rockchip: Use devm_platform_get_and_ioremap_resource()
thermal/drivers/mtk_thermal: Use devm_platform_get_and_ioremap_resource()
thermal/drivers/armada: Use devm_platform_get_and_ioremap_resource()
thermal/drivers/dove: Use devm_platform_get_and_ioremap_resource()
thermal/drivers/bcm2835: Use devm_platform_get_and_ioremap_resource()
thermal/drivers/brcmstb_thermal: Use devm_platform_get_and_ioremap_resource()
thermal/drivers/qcom-spmi-adc-tm5: Use asm intead of asm-generic
thermal/drivers/imx_sc_thermal: Add iMX8QM sensors
thermal/drivers/imx_sc_thermal: Fix the loop condition
thermal/drivers/qcom: Remove duplicate set next trip point interrupt code
thermal/drivers/tsens: Drop single-cell code for msm8976/msm8956
thermal/drivers/tsens: Drop single-cell code for msm8939
thermal/drivers/tsens: Drop single-cell code for mdm9607
...
Make proc_thermal_pci_probe() register the TCPU_PCI thermal zone along
with the trip point used by it and drop the zone callbacks related to
this trip point that are not needed any more.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
[ rjw: Subject and changelog edits ]
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
It is possible that the system manufacturer locks down thermal tuning
beyond what is usually done on the given platform. In that case user
space calibration tools should not try to adjust the thermal
configuration of the system.
To allow user space to check if that is the case, add a new sysfs
attribute "production_mode" that will be present when the ACPI DCFG
method is present under the INT3400 device object in the ACPI Namespace.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
If thermal_class is not registered with the driver core, there is no way
to expose the interfaces used by the thermal control framework, so
prevent thermal zones and cooling devices from being registered in
that case by returning an error from object registration functions.
For this purpose, use a thermal_class pointer that will be NULL if the
class is not registered. To avoid wasting memory in that case, allocate
the thermal class object dynamically and if it fails to register, free
it and clear the thermal_class pointer to NULL.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
The thermal_core.c files contains a lot of functions handling
different thermal components like the governors, the trip points, the
cooling device, the OF cooling device, etc ...
This organization does not help to migrate to a more sane code where
there is a better self-encapsulation as all the components' internals
can be directly accessed from a single file.
For the sake of clarity, let's move the thermal trip points code in a
dedicated thermal_trip.c file and add a function to browse all the
trip points like we do with the thermal zones, the govenors and the
cooling devices.
The same can be done for the cooling devices and the governor code but
that will come later as the current work in the thermal framework is
to fix the trip point handling and use a generic trip point structure.
No functional changes intended.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
As per documentation for the ida_destroy() function: "If the IDA is
already empty, there is no need to call this function."
The thermal framework is in the init sequence, so the ida was not yet
used and consequently it is empty in case of error.
There is no need to call ida_destroy(), let's remove the calls.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The thermal subsystem initialization miss an netlink unregistering
function in the error. Add it.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
In order to prevent int340x_thermal_get_trip_type() from possibly
racing with int340x_thermal_read_trips() invoked by int3403_notify()
add locking to it in analogy with int340x_thermal_get_trip_temp().
Fixes: 6757a7abe4 ("thermal: intel: int340x: Protect trip temperature from concurrent updates")
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Trip temperatures are read using ACPI methods and stored in the memory
during zone initializtion and when the firmware sends a notification for
change. This trip temperature is returned when the thermal core calls via
callback get_trip_temp().
But it is possible that while updating the memory copy of the trips when
the firmware sends a notification for change, thermal core is reading the
trip temperature via the callback get_trip_temp(). This may return invalid
trip temperature.
To address this add a mutex to protect the invalid temperature reads in
the callback get_trip_temp() and int340x_thermal_read_trips().
Fixes: 5fbf7f27fa ("Thermal/int340x: Add common thermal zone handler")
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Cc: 5.0+ <stable@vger.kernel.org> # 5.0+
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The thermal framework gives the possibility to register the trip
points along with the thermal zone. When that is done, no get_trip_*
callbacks are needed and they can be removed.
Convert the existing callbacks content logic into generic trip points
initialization code and register them along with the thermal zone.
In order to consolidate the code, use an ACPI trip library function
to populate a generic trip point.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
[ rjw: Subject and changelog edits, rebase ]
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Tested-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Add library routines to populate a generic thermal trip point
structure with data obtained by evaluating a specific object in the
ACPI Namespace.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Co-developed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Add the PCI ID for the Wellsburg C610 series chipset PCH.
The driver can read the temperature from the Wellsburg PCH with only
the PCI ID added and no other modifications.
Signed-off-by: Tim Zimmermann <tim@linux4.de>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
* thermal: (734 commits)
thermal: core: call put_device() only after device_register() fails
Linux 6.2-rc4
kbuild: Fix CFI hash randomization with KASAN
firmware: coreboot: Check size of table entry and use flex-array
kallsyms: Fix scheduling with interrupts disabled in self-test
ata: pata_cs5535: Don't build on UML
lockref: stop doing cpu_relax in the cmpxchg loop
x86/pci: Treat EfiMemoryMappedIO as reservation of ECAM space
efi: tpm: Avoid READ_ONCE() for accessing the event log
io_uring: lock overflowing for IOPOLL
ALSA: pcm: Move rwsem lock inside snd_ctl_elem_read to prevent UAF
iommu/mediatek-v1: Fix an error handling path in mtk_iommu_v1_probe()
iommu/iova: Fix alloc iova overflows issue
iommu: Fix refcount leak in iommu_device_claim_dma_owner
iommu/arm-smmu-v3: Don't unregister on shutdown
iommu/arm-smmu: Don't unregister on shutdown
iommu/arm-smmu: Report IOMMU_CAP_CACHE_COHERENCY even betterer
platform/x86: thinkpad_acpi: Fix profile mode display in AMT mode
ALSA: usb-audio: Fix possible NULL pointer dereference in snd_usb_pcm_has_fixed_rate()
platform/x86: int3472/discrete: Ensure the clk/power enable pins are in output mode
...
Lets not open code device_unregister() unnecessarily.
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Yang Yingliang <yangyingliang@huawei.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
thermal_release() already frees cdev, let it do rest of the cleanup as
well in order to simplify the error paths in
__thermal_cooling_device_register().
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Yang Yingliang <yangyingliang@huawei.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The driver browses the trip point to find out the critical trip
temperature. However the function thermal_zone_get_crit_temp() does
already that, so the routine is pointless in the driver.
Use thermal_zone_get_crit_temp() instead of inspecting all the trip
points.
In addition, the hysteresis value is set to zero. A critical trip
point does not have a hysteresis.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Miquel Raynal <miquel.raynal@bootlin.com>
Link: https://lore.kernel.org/r/20230118222610.186088-1-daniel.lezcano@linaro.org
Add support for V3 generation thermal found in MT7986 and MT7981 SoCs.
Brings code to assign values from efuse as well as new function to
convert raw temperature to millidegree celsius, as found in MediaTek's
SDK sources (but cleaned up and de-duplicated)
[1]: baf36c7eef
Signed-off-by: Daniel Golle <daniel@makrotopia.org>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Link: https://lore.kernel.org/r/2d341fc45266217249586eb4bd3be3ac4ca83a12.1674055882.git.daniel@makrotopia.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Instead of having if-else logic selecting either raw_to_mcelsius_v1 or
raw_to_mcelsius_v2 in mtk_thermal_bank_temperature introduce a function
pointer raw_to_mcelsius to struct mtk_thermal which is initialized in the
probe function.
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Signed-off-by: Daniel Golle <daniel@makrotopia.org>
Reviewed-by: Matthias Brugger <matthias.bgg@gmail.com>
Link: https://lore.kernel.org/r/69c17529e8418da3eec703dde31e1b01e5b0f7e8.1674055882.git.daniel@makrotopia.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Follow the advice of the Documentation/filesystems/sysfs.rst that show()
should only use sysfs_emit() or sysfs_emit_at() when formatting the
value to be returned to user space.
Signed-off-by: ye xingchen <ye.xingchen@zte.com.cn>
[ rjw: Subject rewrite ]
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
put_device() shouldn't be called before a prior call to
device_register(). __thermal_cooling_device_register() doesn't follow
that properly and needs fixing. Also
thermal_cooling_device_destroy_sysfs() is getting called unnecessarily
on few error paths.
Fix all this by placing the calls at the right place.
Based on initial work done by Caleb Connolly.
Fixes: 4748f9687c ("thermal: core: fix some possible name leaks in error paths")
Fixes: c408b3d1d9 ("thermal: Validate new state in cur_state_store()")
Reported-by: Caleb Connolly <caleb.connolly@linaro.org>
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Tested-by: Frank Rowand <frowand.list@gmail.com>
Reviewed-by: Yang Yingliang <yangyingliang@huawei.com>
Tested-by: Caleb Connolly <caleb.connolly@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Convert platform_get_resource(), devm_ioremap_resource() to a single
call to devm_platform_get_and_ioremap_resource(), as this is exactly
what this function does.
Signed-off-by: ye xingchen <ye.xingchen@zte.com.cn>
Link: https://lore.kernel.org/r/202301181644433003839@zte.com.cn
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Convert platform_get_resource(), devm_ioremap_resource() to a single
call to devm_platform_get_and_ioremap_resource(), as this is exactly
what this function does.
Signed-off-by: ye xingchen <ye.xingchen@zte.com.cn>
Link: https://lore.kernel.org/r/202301181642412733780@zte.com.cn
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Convert platform_get_resource(), devm_ioremap_resource() to a single
call to devm_platform_get_and_ioremap_resource(), as this is exactly
what this function does.
Signed-off-by: ye xingchen <ye.xingchen@zte.com.cn>
Link: https://lore.kernel.org/r/202301181641194943741@zte.com.cn
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Convert platform_get_resource(), devm_ioremap_resource() to a single
call to devm_platform_get_and_ioremap_resource(), as this is exactly
what this function does.
Signed-off-by: ye xingchen <ye.xingchen@zte.com.cn>
Link: https://lore.kernel.org/r/202301181639300333679@zte.com.cn
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Convert platform_get_resource(), devm_ioremap_resource() to a single
call to devm_platform_get_and_ioremap_resource(), as this is exactly
what this function does.
Signed-off-by: ye xingchen <ye.xingchen@zte.com.cn>
Link: https://lore.kernel.org/r/202301181637472073620@zte.com.cn
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Convert platform_get_resource(), devm_ioremap_resource() to a single
call to devm_platform_get_and_ioremap_resource(), as this is exactly
what this function does.
Signed-off-by: ye xingchen <ye.xingchen@zte.com.cn>
Link: https://lore.kernel.org/r/202301181634379503534@zte.com.cn
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Convert platform_get_resource(), devm_ioremap_resource() to a single
call to devm_platform_get_and_ioremap_resource(), as this is exactly
what this function does.
Signed-off-by: ye xingchen <ye.xingchen@zte.com.cn>
Link: https://lore.kernel.org/r/202301181633059433484@zte.com.cn
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Convert platform_get_resource(), devm_ioremap_resource() to a single
call to devm_platform_get_and_ioremap_resource(), as this is exactly
what this function does.
Signed-off-by: ye xingchen <ye.xingchen@zte.com.cn>
Acked-by: Florian Fainelli <f.fainelli@gmail.com>
Link: https://lore.kernel.org/r/202301181636223863583@zte.com.cn
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Convert platform_get_resource(), devm_ioremap_resource() to a single
call to devm_platform_get_and_ioremap_resource(), as this is exactly
what this function does.
Signed-off-by: ye xingchen <ye.xingchen@zte.com.cn>
Acked-by: Florian Fainelli <f.fainelli@gmail.com>
Link: https://lore.kernel.org/r/202301181631362083446@zte.com.cn
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Update function parameter descriptions for sensor_get_auxtrip() and
sensor_set_auxtrip().
[ rjw: New changelog, subject edits ]
Signed-off-by: Deming Wang <wangdeming@inspur.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
There is no point to specify asm-generic for the unaligned.h.
Drop the 'generic' suffix.
Signed-off-by: Andy Shevchenko <andriy.shevchenko@linux.intel.com>
Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Link: https://lore.kernel.org/r/20230103145339.40501-1-andriy.shevchenko@linux.intel.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Add iMX8QM sensors. As stated in 31fd4b9db1 ("thermal/drivers/imx_sc:
Rely on the platform data to get the resource id"):
The thermal OF code returns -ENODEV if the thermal zone registration
with a specific id fails because the description is not available in
the DT for such a sensor id. In this case we continue with the other
ids without bailing out with an error.
Signed-off-by: Viorel Suman <viorel.suman@nxp.com>
Reviewed-by: Dong Aisheng <aisheng.dong@nxp.com>
Link: https://lore.kernel.org/r/20230117091956.61729-2-viorel.suman@oss.nxp.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
The minimal resource ID is 0: IMX_SC_R_AP_0=0, so fix
the loop condition. Aside of this - constify the array.
Fixes: 31fd4b9db1 ("thermal/drivers/imx_sc: Rely on the platform data to get the resource id")
Signed-off-by: Viorel Suman <viorel.suman@nxp.com>
Reviewed-by: Dong Aisheng <Aisheng.dong@nxp.com>
Link: https://lore.kernel.org/r/20230117091956.61729-1-viorel.suman@oss.nxp.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
