Commit graph

60 commits

Author SHA1 Message Date
Ranganath Krishnan e838ff8119 thermal: ti-soc-thermal: Ensure to compute thermal trend
Workaround to compute thermal trend even when update interval
is not set. This patch will ensure to compute the thermal trend
when bandgap counter delay is not set.

Signed-off-by: Ranganath Krishnan <ranganath@ti.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-29 09:36:18 -04:00
Ranganath Krishnan 10ccff1b57 thermal: ti-soc-thermal: Set the bandgap mask counter delay value
Set the bandgap mask counter_delay with the polling_delay value on
registering the thermal zone. This patch will ensure to get the
correct update interval for computing the thermal trend.

Signed-off-by: Ranganath Krishnan <ranganath@ti.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-29 09:36:16 -04:00
Ranganath Krishnan 547f72ab7d thermal: ti-soc-thermal: Initialize counter_delay field for TI DRA752 sensors
Initialize MPU, GPU, CORE, DSPEVE and IVA thermal sensors of DRA752 bandgap
with the counter delay mask.

Signed-off-by: Ranganath Krishnan <ranganath@ti.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-29 09:36:13 -04:00
Eduardo Valentin 57d1617137 thermal: ti-soc-thermal: use standard GPIO DT bindings
This change updates the ti-soc-thermal driver to use
standard GPIO DT bindings to read the GPIO number associated
to thermal shutdown IRQ, in case the device features it.

Previously, the code was using a specific DT bindings.
As now OMAP supports the standard way to model GPIOs,
there is no point in having a ti specific binding.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Grant Likely <grant.likely@linaro.org>
Cc: Rob Herring <rob.herring@calxeda.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Cc: devicetree-discuss@lists.ozlabs.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-07-08 10:11:59 -04:00
Eduardo Valentin 25870e6234 thermal: ti-soc-thermal: add dra752 chip to device table
Add support to TI dra752 chips by adapting the driver
device table.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-06-13 10:16:07 +08:00
Eduardo Valentin 8926fa4f9b thermal: ti-soc-thermal: add thermal data for DRA752 chips
This patch adds the thermal data for TI DRA752 chips.
In this change it includes (autogen):
. Register offset definitions
. Bitfields and masks for all registers
. Conversion table

Also, the thermal limits, thresholds and extrapolation
rules are included. The extrapolation rule is simply
add +2C as margin.

All 5 sensors, MPU, GPU, CORE, DSPEVE and IVA, are defined
and exposed. Only MPU has cooling device.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-06-13 10:15:52 +08:00
Eduardo Valentin 0c12b5ac82 thermal: ti-soc-thermal: remove usage of IS_ERR_OR_NULL
This patch changes the driver to avoid the usage of IS_ERR_OR_NULL()
macro. This macro can lead to dangerous results, like returning
success (0) during a failure scenario (NULL pointer handling).

For this reason this patch is changing the driver after
revisiting the code. These are the cases:
i. For cases in which IS_ERR_OR_NULL() is used for checking
return values of functions that returns either PTR_ERR()
or a valid pointer, it has been translated to IS_ERR() check only.
ii. For cases that a NULL check is still needed, it has been
translated to if (!ptr || IS_ERR(ptr)).

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-06-13 10:14:00 +08:00
Eduardo Valentin ba0049eacc thermal: ti-soc-thermal: freeze FSM while computing trend
In order to read the history buffer, it is required to
freeze BG FSM. This patch adds the missing piece of code
to freeze the FSM and also a contention area to avoid
other parts of the code to access the DTEMPs.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-06-13 10:13:52 +08:00
Eduardo Valentin 359836e1de thermal: ti-soc-thermal: remove external heat while extrapolating hotspot
For boards that provide a PCB sensor close to SoC junction
temperature, it is possible to remove the cumulative heat
reported by the SoC temperature sensor.

This patch changes the extrapolation computation to consider
an external sensor in the extrapolation equations.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-06-13 10:12:22 +08:00
Eduardo Valentin eb982001db thermal: introduce TI SoC thermal driver
This patch moves the ti-soc-thermal driver out of
the staging tree to the thermal tree.

Cc: Grant Likely <grant.likely@linaro.org>
Cc: Rob Herring <rob.herring@calxeda.com>
Cc: Rob Landley <rob@landley.net>
Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <eduardo.valentin@ti.com>
Cc: J Keerthy <j-keerthy@ti.com>
Cc: Radhesh Fadnis <radhesh.fadnis@ti.com>
Cc: Cyril Roelandt <tipecaml@gmail.com>
Cc: devicetree-discuss@lists.ozlabs.org
Cc: linux-doc@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Cc: devel@driverdev.osuosl.org
Cc: linux-pm@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-05-28 10:40:37 +08:00